Reliability Parameter Optimization of Electromagnetic Relay for Aerospace Products Based on 3D Thermal Stress Field

The reliability of thermal and solid coupling relay is an important factor in aerospace products. A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field...

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Bibliographic Details
Published in:IOP conference series. Earth and environmental science 2021-01, Vol.632 (4), p.42059
Main Authors: Mu, Cheng, Song, Wei, Hui, Tianli
Format: Article
Language:English
Subjects:
ANSYS
CAD
Computer aided design
Coupling
Design factors
Design optimization
Design parameters
Electromagnetic relay
Finite element method
Relay
reliability
Reliability analysis
Reliability aspects
Stress distribution
Temperature distribution
Temperature effects
Thermal stress
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Description
Summary:The reliability of thermal and solid coupling relay is an important factor in aerospace products. A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field and thermal stress field are analyzed by using the finite element analysis software ANSYS. Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay.
ISSN:1755-1307
1755-1315
DOI:10.1088/1755-1315/632/4/042059