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Reliability Parameter Optimization of Electromagnetic Relay for Aerospace Products Based on 3D Thermal Stress Field
The reliability of thermal and solid coupling relay is an important factor in aerospace products. A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field...
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Published in: | IOP conference series. Earth and environmental science 2021-01, Vol.632 (4), p.42059 |
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description | The reliability of thermal and solid coupling relay is an important factor in aerospace products. A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field and thermal stress field are analyzed by using the finite element analysis software ANSYS. Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay. |
doi_str_mv | 10.1088/1755-1315/632/4/042059 |
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A refined model based on the internal constitutive characteristics of the device is established, and the thermal solid coupling relationship curve is established. The three-dimensional temperature field and thermal stress field are analyzed by using the finite element analysis software ANSYS. Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay.</description><identifier>ISSN: 1755-1307</identifier><identifier>EISSN: 1755-1315</identifier><identifier>DOI: 10.1088/1755-1315/632/4/042059</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>ANSYS ; CAD ; Computer aided design ; Coupling ; Design factors ; Design optimization ; Design parameters ; Electromagnetic relay ; Finite element method ; Relay ; reliability ; Reliability analysis ; Reliability aspects ; Stress distribution ; Temperature distribution ; Temperature effects ; Thermal stress</subject><ispartof>IOP conference series. Earth and environmental science, 2021-01, Vol.632 (4), p.42059</ispartof><rights>Published under licence by IOP Publishing Ltd</rights><rights>2021. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). 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Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay.</description><subject>ANSYS</subject><subject>CAD</subject><subject>Computer aided design</subject><subject>Coupling</subject><subject>Design factors</subject><subject>Design optimization</subject><subject>Design parameters</subject><subject>Electromagnetic relay</subject><subject>Finite element method</subject><subject>Relay</subject><subject>reliability</subject><subject>Reliability analysis</subject><subject>Reliability aspects</subject><subject>Stress distribution</subject><subject>Temperature distribution</subject><subject>Temperature effects</subject><subject>Thermal stress</subject><issn>1755-1307</issn><issn>1755-1315</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><recordid>eNqFkE1LAzEQhhdRsFb_ggS8eFk3H5v9ONa6VaHQYus5ZLOJpuw2a5Ie6q83ZaUiCJ5mYN5nhnmi6BrBOwSLIkE5pTEiiCYZwUmawBRDWp5Eo-Pg9NjD_Dy6cG4DYZanpBxF7kW2mte61X4PltzyTnppwaL3utOf3GuzBUaBqpXCW9Pxt630WoBA8T1QxoKJtMb1XEiwtKbZCe_APXeyAQEkD2D9Lm3HW7DyVjoHZlq2zWV0pnjr5NV3HUevs2o9fYrni8fn6WQeC0JTH-ccCpopnKelwKQWWECU54LXBVFcCRlaRJusKWH4hlCC0zotOORUBAMlycg4uhn29tZ87KTzbGN2dhtOMpyhgmaUFDiksiElwiPOSsV6qztu9wxBdhDMDu7YwSMLglnKBsEBxAOoTf-z-V_o9g-oqla_YqxvFPkCZ1eKQQ</recordid><startdate>20210101</startdate><enddate>20210101</enddate><creator>Mu, Cheng</creator><creator>Song, Wei</creator><creator>Hui, Tianli</creator><general>IOP Publishing</general><scope>O3W</scope><scope>TSCCA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ATCPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BHPHI</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>PATMY</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PYCSY</scope></search><sort><creationdate>20210101</creationdate><title>Reliability Parameter Optimization of Electromagnetic Relay for Aerospace Products Based on 3D Thermal Stress Field</title><author>Mu, Cheng ; Song, Wei ; Hui, Tianli</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c354t-7a0c56f2749c23bc2c0177cab83fafce7ca15d6d9000635324b48a0a5c0429363</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>ANSYS</topic><topic>CAD</topic><topic>Computer aided design</topic><topic>Coupling</topic><topic>Design factors</topic><topic>Design optimization</topic><topic>Design parameters</topic><topic>Electromagnetic relay</topic><topic>Finite element method</topic><topic>Relay</topic><topic>reliability</topic><topic>Reliability analysis</topic><topic>Reliability aspects</topic><topic>Stress distribution</topic><topic>Temperature distribution</topic><topic>Temperature effects</topic><topic>Thermal stress</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mu, Cheng</creatorcontrib><creatorcontrib>Song, Wei</creatorcontrib><creatorcontrib>Hui, Tianli</creatorcontrib><collection>Open Access: IOP Publishing Free Content</collection><collection>IOPscience (Open Access)</collection><collection>CrossRef</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>Agricultural & Environmental Science Collection</collection><collection>ProQuest Central Essentials</collection><collection>AUTh Library subscriptions: ProQuest Central</collection><collection>Natural Science Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Environmental Science Database</collection><collection>ProQuest Publicly Available Content database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Environmental Science Collection</collection><jtitle>IOP conference series. 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The three-dimensional temperature field and thermal stress field are analyzed by using the finite element analysis software ANSYS. Through the simulation of the thermal field and thermal stress field under different parameters, the design factors affecting the internal thermal distribution of the device are preliminarily analyzed, which provides the parameter basis for the reliability optimization design of the relay.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/1755-1315/632/4/042059</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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subjects | ANSYS CAD Computer aided design Coupling Design factors Design optimization Design parameters Electromagnetic relay Finite element method Relay reliability Reliability analysis Reliability aspects Stress distribution Temperature distribution Temperature effects Thermal stress |
title | Reliability Parameter Optimization of Electromagnetic Relay for Aerospace Products Based on 3D Thermal Stress Field |
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