The effect of the grain refinement on the corrosion resistance of the CoCrNi medium-entropy alloy in chloride solution

The ratio of the twin decreased after thermomechanical process for the CoCrNi medium-entropy alloy. The grain refinement decreased the passive current and increased the breakdown potential of the CoCrNi medium-entropy alloy in sodium chloride solution. The electrochemical impedance spectroscopy anal...

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Bibliographic Details
Published in:Intermetallics 2022-02, Vol.141, p.107423, Article 107423
Main Authors: Jinlong, Lv, Zhiheng, Tan, Liu, Tong
Format: Article
Language:English
Subjects:
Alloying elements
Alloys
Chloride resistance
Corrosion
Corrosion effects
Corrosion resistance
Defects
Diffusion rate
Electrochemical impedance spectroscopy
Entropy
Entropy of solution
Grain refinement
Interface
Medium entropy alloys
Nucleation
Recrystallization
Sodium chloride
Thermomechanical treatment
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Summary:The ratio of the twin decreased after thermomechanical process for the CoCrNi medium-entropy alloy. The grain refinement decreased the passive current and increased the breakdown potential of the CoCrNi medium-entropy alloy in sodium chloride solution. The electrochemical impedance spectroscopy analysis showed that the grain refinement of the CoCrNi medium-entropy alloy facilitated to form thicker passive films and larger passive film resistance, which thus resulted into better corrosion resistance in sodium chloride solution. More nucleation sites after the grain refinement could enhance diffusion rate of alloying element and promote to form thicker and more stable passive films on refined grain CoCrNi medium-entropy alloy. Moreover, sufficient recrystallization level within refined grains for the CoCrNi MEA also improved its corrosion resistance. [Display omitted] •The ratio of twin decreased after thermomechanical process for CoCrNi medium-entropy alloy.•The grain refinement decreased the passive current of the CoCrNi medium-entropy alloy in NaCl solution.•More nucleation sites after the grain refinement promoted to form thicker and more stable passive films.
ISSN:0966-9795
1879-0216
DOI:10.1016/j.intermet.2021.107423