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Rapid sintering by thermo-compression in air using a paste containing bimodal-sized silver-coated copper particles and effects of particle size and surface finish type

•Bimodal-sized Cu@Ag particles and novel reductant were adopted for fast sintering.•Sintering in between Ag finishes was performed using pastes containing the bimodal Cu@Ag.•200-nm particles, as the second size, exhibited the most remarkable sintering properties.•Only 3-min sintering at 300 °C in ai...

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Bibliographic Details
Published in:Journal of alloys and compounds 2022-03, Vol.897, p.163223, Article 163223
Main Authors: Choi, Eun Byeol, Lee, Yun-Ju, Lee, Jong-Hyun
Format: Article
Language:English
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Summary:•Bimodal-sized Cu@Ag particles and novel reductant were adopted for fast sintering.•Sintering in between Ag finishes was performed using pastes containing the bimodal Cu@Ag.•200-nm particles, as the second size, exhibited the most remarkable sintering properties.•Only 3-min sintering at 300 °C in air under compression exhibited a strength of 20.7 MPa.•The remarkable sintering properties in air were maintained even in between Cu finishes. [Display omitted] To rapidly form a highly thermal-conductive line structure that could be sustained even at high temperatures such as 300 °C, the compression (5 MPa)-assisted sintering of a Ag-finished die on an Ag-finished substrate was performed in air employing a paste containing bimodal-sized Ag-coated Cu (Cu@Ag) particles at a ratio of 6 (1.5 µm):4 (800, 400, and 200 nm). The 200-nm particles among the submicrometer-sized particles provided the most enhanced sinterability on both joint strength and microstructure. Accordingly, the 1.5-µm/200-nm Cu@Ag paste exhibited excellent shear strength surpassing 20 MPa, accompanied with a near full-density structure, even by the short sintering for 3 min. The strength eventually exceeded 45 MPa after 10 min. These results demonstrate the successful development of an effective paste to achieve rapid sintering even in air with low material cost.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2021.163223