Low‐dielectric constant and viscosity tetrafunctional bio‐based epoxy resin containing cyclic siloxane blocks

Bio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high‐dissociation energy, and elevated molecular volume,...

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Bibliographic Details
Published in:Journal of applied polymer science 2022-05, Vol.139 (20), p.n/a
Main Authors: Zhang, Pengbo, Yao, Tongjie, Xue, Kangle, Meng, Xianbin, Zhang, Junying, Liu, Li
Format: Article
Language:English
Subjects:
biomaterials
dielectric properties
Elongation
Energy of dissociation
Epoxy resins
Free energy
Glass transition temperature
Heat of formation
Hydrosilylation
Materials science
Mechanical properties
Monomers
Permittivity
Polymers
Rapid prototyping
resins
Siloxanes
Tensile strength
viscoelasticity
Viscosity
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Summary:Bio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical properties have great significance for the future of advanced electronic and microelectronic industries. Cyclosiloxane segment possesses low polarity, high‐dissociation energy, and elevated molecular volume, thereby making it useful for the synthesis of materials with low dielectric constant and viscosity. Herein, a tetrafunctional eugenol‐based epoxy resin (DEP) based on a cyclosiloxane structure was designed and prepared through a hydrosilylation reaction. Allyl glycidyl ether (AGE) was selected as a reference compound and generated a silylation epoxy resin (AGDEP). The viscosity of these silicone‐containing tetrafunctional epoxy monomers (
ISSN:0021-8995
1097-4628
DOI:10.1002/app.52176