Environmentally sustainable, high-performance lignin-derived universal adhesive

The production of unfavorable formaldehyde-based adhesives could be replaced by that of lignin-based adhesives as an improved, healthy and sustainable candidate. Here, a facile method was realized for a novel lignin-based, robust, and universally applicable adhesive (84% yield), based on the synergi...

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Published in:Green chemistry : an international journal and green chemistry resource : GC 2022-03, Vol.24 (6), p.2624-2635
Main Authors: Singh, Sandip K, Ostendorf, Kolja, Euring, Markus, Zhang, Kai
Format: Article
Language:English
Subjects:
Acrylic acid
Adhesives
Aluminum
Bond strength
Bonding strength
Covalent bonds
Dimethylformamide
Glass substrates
Green chemistry
Lignin
Loss modulus
Mechanical properties
pH effects
Polycarbonate
Polyvinyl chloride
Stainless steel
Stainless steels
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Summary:The production of unfavorable formaldehyde-based adhesives could be replaced by that of lignin-based adhesives as an improved, healthy and sustainable candidate. Here, a facile method was realized for a novel lignin-based, robust, and universally applicable adhesive (84% yield), based on the synergistic reaction between lignin, dimethylformamide, and acrylic acid under a basic environment. Characterization studies of the synergistically synthesized lignin-based adhesive showed the formation of new C-O, C-N, and C-C bonds. These bonds contributed strongly to excellent adhesive performance on versatile substrates, including glass, aluminum, stainless steel, polycarbonate, polyvinyl chloride, and wood. This universal adhesive was able to hold vertically or horizontally >2.0 × 10 5 times its own weight for more than 94 d. It also exhibited excellent storage and loss modulus, internal bond strength (255.0 kPa), and physical-mechanical strength under neutral, acidic (pH 3.08) or basic (pH 10.22) media. These advantages enable this lignin-based adhesive to be a universal adhesive in various settings. A lignin-based adhesive was developed with the formation of new C-O, C-N, and C-C bonds that contributed to adhesive performance on versatile substrates.
ISSN:1463-9262
1463-9270
DOI:10.1039/d2gc00014h