Effect of annealing temperature to magnetoimpedance on multilayer film [Ni80Fe20/Cu]x/Cu/[Ni80Fe20/Cu]6-x for symmetry and non-symmetry structures

The phenomenon of magnetoimpedance (MI) on multilayer symmetry structures [Ni80Fe20/Cu]3/Cu/[Ni80Fe20/Cu]3 and non-symmetry [Ni80Fe20/Cu] /Cu/[Ni80Fe20/Cu]5 has been successfully investigated. The two types of multilayer structures were deposited on the Cu Meander PCB substrate by electrodeposition...

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Bibliographic Details
Main Authors: Rusydan, Dian Afiff, Purnama, Budi, Sutomo, Utari, Artono Dwijo
Format: Conference Proceeding
Language:English
Subjects:
Annealing
Magnetoimpedance
Multilayers
Substrates
Symmetry
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Summary:The phenomenon of magnetoimpedance (MI) on multilayer symmetry structures [Ni80Fe20/Cu]3/Cu/[Ni80Fe20/Cu]3 and non-symmetry [Ni80Fe20/Cu] /Cu/[Ni80Fe20/Cu]5 has been successfully investigated. The two types of multilayer structures were deposited on the Cu Meander PCB substrate by electrodeposition method. Magnetoimpedance measurements were carried out at a low frequency, 100 kHz. From the two samples, the annealing temperature was varied, and it was found that an increase in temperature resulted in a decrease in the magnetoimpedance ratio. In addition, it has been confirmed that the symmetry structure [Ni80Fe20 /Cu]3/Cu/[Ni80Fe20/Cu]3 has a higher magnetoimpedance ratio than the non-symmetry structure [Ni80Fe20/Cu]/Cu/[Ni80Fe20/Cu]5 with variation of annealing temperature 30 °C, 40 °C, 50 °C, 60 °C, and 70 °C.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0072431