A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-sca...

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Bibliographic Details
Published in:arXiv.org 2022-04
Main Authors: Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan, Bailey, Chris, Coyle, Richard J, Gourlay, Christopher M, Dunne, Fionn P E
Format: Article
Language:English
Subjects:
Ball grid packaging
Copper
Crystal structure
Crystallography
Damage
Fatigue failure
Microstructure
Modelling
Multiscale analysis
Silver
Single crystals
Soldered joints
Solders
Thermal cycling
Thermal fatigue
Tin
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Summary:This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.
ISSN:2331-8422
DOI:10.48550/arxiv.2204.05583