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Electromechanical Coupling and Application of High-Frequency Communication Antenna Channel Capacity
The next-generation communication base station antennas represented by phased array antennas are towards high frequency, high gain, high density, and high pointing accuracy. The influence of mechanical structure factors on communication system channel quality is obviously increasing, and the electro...
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Published in: | Electronics (Basel) 2022-06, Vol.11 (12), p.1857 |
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Main Authors: | , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | The next-generation communication base station antennas represented by phased array antennas are towards high frequency, high gain, high density, and high pointing accuracy. The influence of mechanical structure factors on communication system channel quality is obviously increasing, and the electromechanical coupling problem is becoming more prominent. To effectively guarantee the realization of 5G/6G communication in complex working environments and accelerate the commercial process of future communication systems, an electromechanical coupling channel capacity model is established in comprehensive consideration of the positional shift, attitude deflection, and temperature change of the communication base station phased array antennas. It can be used to rapidly evaluate the communication index degradation of RF devices within the heating environment. Moreover, a sensitivity model of the electric field strength and array antenna channel capacity to the random position error of each element is constructed. The influence of the random positioning error of each element on the communication indicators is analyzed and compared under different working conditions. The simulation results show that the proposed model can effectively provide a theoretical basis and guiding role for the design and manufacture of high-frequency array base station antennas. |
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ISSN: | 2079-9292 2079-9292 |
DOI: | 10.3390/electronics11121857 |