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P‐96: Optimization Analysis for R1.5mm Teardrop Shape Foldable AMOLED Module by Finite‐Element Analysis

The FEA(Finite Element Analysis) is used to study the optimization of the teardrop shape and stack‐up DOE. We use the viscoelastic model to optimize the teardrop shape parameter: the angle a and the arc‐radius r,. We studied Stack‐up optimization by changing the OCA modulus to reduce the risk of coh...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2022-06, Vol.53 (1), p.1381-1384
Main Authors: Zeng, Jia, Qing, Wei, Liu, Shao kui, Wang, Zhi hui, Zhang, Lei, Min, Hang, Shang, Fei
Format: Article
Language:English
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Summary:The FEA(Finite Element Analysis) is used to study the optimization of the teardrop shape and stack‐up DOE. We use the viscoelastic model to optimize the teardrop shape parameter: the angle a and the arc‐radius r,. We studied Stack‐up optimization by changing the OCA modulus to reduce the risk of cohesion failure. An 8.0inch teardrop shape foldable AMOLED display prototype was fabricated with a bending radius R=1.5mm.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.15770