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P‐96: Optimization Analysis for R1.5mm Teardrop Shape Foldable AMOLED Module by Finite‐Element Analysis
The FEA(Finite Element Analysis) is used to study the optimization of the teardrop shape and stack‐up DOE. We use the viscoelastic model to optimize the teardrop shape parameter: the angle a and the arc‐radius r,. We studied Stack‐up optimization by changing the OCA modulus to reduce the risk of coh...
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Published in: | SID International Symposium Digest of technical papers 2022-06, Vol.53 (1), p.1381-1384 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | The FEA(Finite Element Analysis) is used to study the optimization of the teardrop shape and stack‐up DOE. We use the viscoelastic model to optimize the teardrop shape parameter: the angle a and the arc‐radius r,. We studied Stack‐up optimization by changing the OCA modulus to reduce the risk of cohesion failure. An 8.0inch teardrop shape foldable AMOLED display prototype was fabricated with a bending radius R=1.5mm. |
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ISSN: | 0097-966X 2168-0159 |
DOI: | 10.1002/sdtp.15770 |