CMOS-Compatible and Temperature Insensitive C-band Wavelength (De-)multiplexer

The high thermal sensitivity of the Silicon Photonics (SiP) platform compromises the performance of variant devices and increases the power consumption to stabilize the temperature. To address this issue, we demonstrate a CMOS-compatible and temperature insensitive 1×4 C-band wavelength division (de...

Full description

Saved in:
Bibliographic Details
Published in:IEEE photonics technology letters 2022-01, Vol.34 (14), p.1-1
Main Authors: Mao, Deng, Wang, Yun, Xu, Luhua, Zhang, Jinsong, El-Fiky, Eslam, Alam, Md Samiul, D'Mello, Yannick, Lessard, Stephane, Plant, David V.
Format: Article
Language:English
Subjects:
(de-)multiplexers
C band
CMOS
Couplers
Data centers
Delay lines
Delays
Indexes
Mach-Zehnder interferometers
Multiplexers
Power consumption
Power management
Sensitivity
Silicon
Silicon-on-insulator
Temperature measurement
Temperature sensors
Thermal stability
thermaloptics
Waveguides
Wavelength division multiplexing
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The high thermal sensitivity of the Silicon Photonics (SiP) platform compromises the performance of variant devices and increases the power consumption to stabilize the temperature. To address this issue, we demonstrate a CMOS-compatible and temperature insensitive 1×4 C-band wavelength division (de-)multiplexer on the 220-nm-thick silicon-on-insulator platform. The (de-)multiplexer design is based on cascading Mach-Zehnder interferometers (MZIs). The waveguide widths of the MZI delay lines are matched to decrease the overall thermo-optic coefficient (TOC). For comparison, an MZI-based (de-)multiplexer with uniform delay lines is also fabricated on the same chip. The transmission spectra of the proposed and reference devices are measured when the wavelength is swept from 1500 nm to 1600 nm and the temperature is varied from 293.15 K to 323.15 K. The measured results show that the TOCs of the proposed and reference device are 4.8 pm/K and 85 pm/K, respectively. This power-efficient multiplexer with high integration density is promising for data center applications.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2022.3185925