Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints

• Published in: Journal of materials science. Materials in electronics 2022-08, Vol.33 (23), p.18751-18757
• Main Authors: Wang, Y. W., Wu, G. W., Tseng, T. T., Liang, H. T.
• Format: Article
• Language: English
• Subjects: Aerospace industry; Characterization and Evaluation of Materials; Chemical bonds; Chemistry and Materials Science; Conductors; Copper; Corrosion prevention; Indium; Interdiffusion; Intermetallic compounds; Low resistance; Low temperature; Materials Science; Melting points; Microstructure; Nickel; Optical and Electronic Materials; Production costs; Room temperature; Soldering; Solders; Thermal cycling; Wearable technology
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-022-08723-7

Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for reducing temperature and manufacturing costs. Indium has a low melting point, low resistance and good anticorrosion properties. Indium plays important roles in transparent conductors, the aerospace industry and flexible displays. Solid–liquid interdiffusion (SLID) bonding is one of the most reliable 3D integration technologies. The microstructure of the Cu/In/Ni bonding interface was investigated in this study. A low temperature of 180 °C was used for SLID bonding. Cu-In compounds, Cu 11 In 9 and CuIn 2 , were formed after SLID bonding at 180 °C and storing at room temperature. The reaction between Cu and In is fast, even at room temperature. The low-temperature CuIn 2 phase is undoubtedly worth investigating for solder joints.