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Areca/synthetic fibers reinforced based epoxy hybrid composites for semi‐structural applications
The recent developments and technological advancement in material science focus on the utilization of biodegradable material in various engineering applications. The increase in concern for the damages happening by synthetic materials has made the researchers develop novel materials that can reduce...
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Published in: | Polymer composites 2022-08, Vol.43 (8), p.5222-5234 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The recent developments and technological advancement in material science focus on the utilization of biodegradable material in various engineering applications. The increase in concern for the damages happening by synthetic materials has made the researchers develop novel materials that can reduce the use of synthetic materials to minimize the environmental problem and societal anxiety. In this work, the four‐layered areca/carbon/kevlar/carbon–kevlar hybrid fiber‐reinforced epoxy laminates were prepared by using hand layup technique for seven different stacking sequence. The prepared laminates were evaluated for mechanical, thermal, and water absorption behavior to study the hybridization effect on the properties of the composites. The result indicated that areca/carbon composites had better mechanical properties than areca/kevlar, areca/carbon–kevlar hybrid laminates. Hybridization of areca fiber with synthetic fibers had significant effect on the mechanical properties of the composites. The water absorption behavior and thermal property of the laminates improved with addition of synthetic fibers to areca fiber. Morphological analysis showed strong bonding with fibers and reinforcements, with fewer voids. Therefore, the developed areca/synthetic fiber hybrid composites can be used for semi‐structural engineering applications. |
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ISSN: | 0272-8397 1548-0569 |
DOI: | 10.1002/pc.26814 |