Advancements in Industrial Cyber-Physical Systems: An Overview and Perspectives

Cyber-physical systems (CPSs) have attracted increasing attention in recent years due to their promise for substantial and long-term benefits to society, economy, environment, and citizens. In addition, the rapid advances in computing, communication, and storage technologies have resulted in a revol...

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Bibliographic Details
Published in:IEEE transactions on industrial informatics 2023-01, Vol.19 (1), p.716-729
Main Authors: Zhang, Kunwu, Shi, Yang, Karnouskos, Stamatis, Sauter, Thilo, Fang, Huazhen, Colombo, Armando Walter
Format: Article
Language:English
Subjects:
Cloud computing
Communication and networking
control
cyber security
Cyber-physical systems
Domains
Fourth Industrial Revolution
Industrial applications
industrial cyber-physical system (ICPS)
Industries
Informatics
information acquisition
Internet
Process control
Production
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Summary:Cyber-physical systems (CPSs) have attracted increasing attention in recent years due to their promise for substantial and long-term benefits to society, economy, environment, and citizens. In addition, the rapid advances in computing, communication, and storage technologies have resulted in a revolution in the information communication technology domain and domination in the industry context. The utilization of CPSs in industrial settings has led to industrial cyber-physical systems (ICPSs), which, in conjunction with the information-driven interactions, enables large-scale cooperation in industrial facilities and among all the stakeholders of the value chain. Hence, the research on ICPSs is essential, especially with respect to the engineering of such systems for industrial applications. This article presents an overview of recent developments in ICPSs. We first introduce the architecture of ICPSs. Then, we review the developments of ICPSs in relevant research domains. Finally, this article concludes by presenting some potential future research directions on ICPSs.
ISSN:1551-3203
1941-0050
DOI:10.1109/TII.2022.3199481