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Corrosion of Gold Bridgewire in Electronic Components

Accelerated aging tests on detonator assemblies, to verify the compatibility of gold bridgewire and Pd-In-Sn solder with the intended explosives, revealed an unusual form of corrosion. The tests, conducted at 74 °C (165 °F) and 54 °C (130 °F), indicated a preferential attack of the gold. To investig...

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Published in:Journal of failure analysis and prevention 2022-12, Vol.22 (6), p.2450-2458
Main Authors: Downs, G. L., Braun, J. D., Tibbitts, E. E.
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description Accelerated aging tests on detonator assemblies, to verify the compatibility of gold bridgewire and Pd-In-Sn solder with the intended explosives, revealed an unusual form of corrosion. The tests, conducted at 74 °C (165 °F) and 54 °C (130 °F), indicated a preferential attack of the gold. To investigate the problem, a matrix of test units was produced and analyzed. Scanning electron microscopy, EDX analysis, and x-ray diffraction techniques were used to determine the extent of the corrosion and identify the corrosion products. The results indicated that the preferential attack of the gold was due to HCN formed by decomposition of the explosive powder at high temperatures. Other associated reactions were also observed including the subsequent attack of the solder by the gold corrosion product and degradation of the plastic header.
doi_str_mv 10.1007/s11668-022-01542-2
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ispartof Journal of failure analysis and prevention, 2022-12, Vol.22 (6), p.2450-2458
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1864-1245
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subjects Accelerated aging tests
Case History---Peer-Reviewed
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Corrosion and Coatings
Corrosion products
Corrosion tests
Decomposition reactions
Detonators
Electronic components
Gold
High temperature
Materials Science
Preferential attack (corrosion)
Quality Control
Reliability
Safety and Risk
Solders
Solid Mechanics
Tribology
title Corrosion of Gold Bridgewire in Electronic Components
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