Kinetic stability diagram for copper in borate buffer solution

The passivity of pure copper over a wide pH range has been explored using potentiodynamic and potentiostatic polarization, Mott–Schottky analysis, and electrochemical impedance spectroscopy (EIS). The study shows that the passive film is a p‐type semiconductor. The natural logarithm of the passive c...

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Bibliographic Details
Published in:Materials and corrosion 2023-03, Vol.74 (3), p.352-363
Main Authors: Mao, Feixiong, Zhou, Yuting, Dong, Chaofang, Macdonald, Digby D.
Format: Article
Language:English
Subjects:
borate buffer
Buffer solutions
Copper
EIS
Electrochemical impedance spectroscopy
Film growth
modelling studies
passivity
Point defects
Stability
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Summary:The passivity of pure copper over a wide pH range has been explored using potentiodynamic and potentiostatic polarization, Mott–Schottky analysis, and electrochemical impedance spectroscopy (EIS). The study shows that the passive film is a p‐type semiconductor. The natural logarithm of the passive current density is found to linearly increase with the film formation potential. The passive state of copper is interpreted by optimizing the point defect model (PDM) on the EIS data. Kinetic stability diagrams are derived for pure copper in borate buffer based on the rate law for passive film growth in accordance with the PDM. The corrosion behavior of copper in different pH solutions was investigated. The thickness of barrier layer on the copper surface calculated by the point defect model ranges from 1.55 to 2.53 nm when pH = 8.5–12.5 and applied voltage = 0.2–0.8 VSCE. Kinetic stability diagrams are plotted to directly exhibit the passive region of copper in solutions at room temperature.
ISSN:0947-5117
1521-4176
DOI:10.1002/maco.202213405