Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

• Published in: Rare metals 2023-03, Vol.42 (3), p.1043-1049
• Main Authors: Sui, Yan-Wei, Sun, Ren, Qi, Ji-Qiu, He, Ye-Zeng, Wei, Fu-Xiang, Meng, Qing-Kun, Sun, Zhi
• Format: Article
• Language: English
• Subjects: Aging; Biomaterials; Chemistry and Materials Science; Energy; Grains; Intermetallic compounds; Materials Engineering; Materials Science; Mechanical properties; Metallic Materials; Morphology; Nanoparticles; Nanoscale Science and Technology; Physical Chemistry; Shear strength; Soldered joints; Soldering; Solders; Substrates
• ISSN: 1001-0521; 1867-7185
• DOI: 10.1007/s12598-017-0968-8

This study investigated the morphologies of the intermetallic compounds (IMC) formed during soldering reaction between Sn1.0Ag0.7Cu–1.0SnO 2 composite solder and Cu substrate at various temperatures. The prism-type Cu 6 Sn 5 forms when the soldering temperature is 260 or 280 °C, while those grains transform from prism type to scallop type at the temperatures of 300 and 320 °C. It can be found that the morphologies of Cu 6 Sn 5 grains affect adsorption of Ag 3 Sn nanoparticles during soldering reaction. The scallop-type grains with a higher growth rate need to adsorb large amounts of Ag 3 Sn particles. In terms of mechanical behavior, the shear strength of solder joint is improved from 40 to 46 MPa at soldering temperature of 300 °C. In addition, the thickness of IMC increases with the extension of aging time. During aging, the morphology of Cu 6 Sn 5 grains remains scallop type, but the number of Ag 3 Sn nanoparticles is reduced largely. The scallop-type Cu 6 Sn 5 can increase in size and flatten in morphology with the aging time increasing. Graphical Abstract When the soldering temperature changes from 260 to 360 °C, the morphologies of Cu 6 Sn 5 grains transformed from prism-type to scallop-type. The shear strength of solder joint is improved from 40 to 46 Mpa at 300 °C soldering temperature