Loading…
Micropolar thermoelastic plane waves in microscopic materials caused by Hall-current effects in a two-temperature heat conduction model with higher-order time derivatives
According to the concept of small polar thermoelasticity, rotational and translational motions of elastic materials can cause aggregate deformations, temperature changes, and microcycles. This theory is used to study atomic and molecular vibrations and the deformation of solids due to changes in tem...
Saved in:
Published in: | Archive of applied mechanics (1991) 2023-05, Vol.93 (5), p.1901-1924 |
---|---|
Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | According to the concept of small polar thermoelasticity, rotational and translational motions of elastic materials can cause aggregate deformations, temperature changes, and microcycles. This theory is used to study atomic and molecular vibrations and the deformation of solids due to changes in temperature and other energetic forces. The current study investigates the two-dimensional electromagnetic micropolar thermoelasticity of an elastic medium whose surface is heated by a heat source and influenced by a transverse magnetic field. This work combines the higher-order dual phase lag model with the two-temperature theory to address this investigation. Using the normal mode approach to the system equations, we have calculated the temperature normal force stress, displacements, and tangential couple stress in the physical domain. The corresponding expressions of the studied fields are provided, and corresponding graphical examples are also provided. Numerical comparisons were made to investigate the effects of the discrepancy index, the Hall current, and higher-order derivatives. It is concluded from the present contribution that some advanced thermoelastic systems deserve study. |
---|---|
ISSN: | 0939-1533 1432-0681 |
DOI: | 10.1007/s00419-023-02362-y |