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Single-Layer Dual-/Tri-band SIW Filtenna Based on Multifunctional Cavity- Backed Slots

Single-layer dual-/tri-band substrate integrated waveguide (SIW) filtenna based on multifunctional cavity-backed slots is proposed in this communication. The cavity-backed slots etched on the SIW cavity can be considered as radiators as well as resonators. When a pair of back-to-back open-loop slots...

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Bibliographic Details
Published in:IEEE transactions on antennas and propagation 2023-05, Vol.71 (5), p.1-1
Main Authors: Zheng, Zhirui, Li, Daotong, Tan, Xiaoheng, Chen, Qiang
Format: Article
Language:English
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Summary:Single-layer dual-/tri-band substrate integrated waveguide (SIW) filtenna based on multifunctional cavity-backed slots is proposed in this communication. The cavity-backed slots etched on the SIW cavity can be considered as radiators as well as resonators. When a pair of back-to-back open-loop slots embedded with a straight slot are etched on the SIW cavity, three resonant modes generated by slots combine with TE 101 mode of the SIW cavity to form the superior dual-band filtering response. Moreover, four radiation nulls (RNs) located at both sides of two operational passbands are generated, resulting in the sharp roll-offs and deep stopband rejection. To further prove this design concept, a tri-band SIW filtenna is designed by utilizing two pairs of back-to-back open-loop slots embedded with a straight slot, six RNs are introduced in the stopbands, realizing the excellent tri-band filtering performance. The operating mechanism of the proposed antennas is numerically analyzed. Two prototype antennas are fabricated and tested to validation, the center frequencies of the dual-band filtenna are 4.56 and 5.7 GHz, and the tri-band filtenna are centered at 4.1, 4.82 and 5.62 GHz, showing good radiation characteristics in each passband. Compared with other designs, the proposed antennas exhibit the advantages of single-layer structure, small size and high selectivity, satisfying the requirements of 5G multi-frequency communication applications.
ISSN:0018-926X
1558-2221
DOI:10.1109/TAP.2023.3242110