Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Cu sintering has attracted considerable attention because of its low electrical resistance, high thermal conductivity, low resistance to ion migration, and reasonable price. But, the unique oxidation tendency of Cu is the leading cause of hindering Cu sintering. Several methods have been proposed to...

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Published in:Journal of materials science. Materials in electronics 2023-07, Vol.34 (19), p.1459, Article 1459
Main Authors: Son, Junhyuk, Yu, Dong-Yurl, Kim, Yun-Chan, Kim, Shin-Il, Byun, Dongjin, Bang, JungHwan
Format: Article
Language:English
Subjects:
Additives
Bonding strength
Characterization and Evaluation of Materials
Chemical reduction
Chemistry and Materials Science
Copper
Copper oxides
Dicarboxylic acids
Electric vehicles
Electrical resistivity
Heat conductivity
Ion migration
Low resistance
Materials Science
Optical and Electronic Materials
Oxidation
Oxidation resistance
Polyethylene glycol
Raw materials
Semiconductors
Shear strength
Sintering
Solvents
Storage stability
Thermal conductivity
Thermal resistance
Viscosity
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Summary:Cu sintering has attracted considerable attention because of its low electrical resistance, high thermal conductivity, low resistance to ion migration, and reasonable price. But, the unique oxidation tendency of Cu is the leading cause of hindering Cu sintering. Several methods have been proposed to solve this oxidation problem. In this study, Cu paste for die attachment was prepared by selecting appropriate solvents, activators, and additives. The sintering properties and bonding strength of Cu paste were governed by the molecular weight and the chain length of the solvent. Among various solvents, the highest shear strength was observed in the case of polyethylene glycol (PEG) solvent. The addition of dicarboxylic acid allowed for a faster reduction rate of copper oxide, which improved Cu sintering performance. A Cu binder with a stable reduction reaction and storage stability was developed by applying a phenol-based antioxidant.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-023-10833-9