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High-Breakdown P-Channel GaN MOS-HFETs with Al2O3-Dielectric and Drain Field-Plate
This work reports record-high three-terminal on-state drain-source breakdown voltage (BVDS) of -735 V in p-channel GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) with a drain field-plate (DFP). High-k and wide-gap Al2O3 was deposited as the gate oxide and surface...
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Published in: | IEEE journal of the Electron Devices Society 2023-01, Vol.11, p.1-1 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | This work reports record-high three-terminal on-state drain-source breakdown voltage (BVDS) of -735 V in p-channel GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOS-HFETs) with a drain field-plate (DFP). High-k and wide-gap Al2O3 was deposited as the gate oxide and surface passivation by using a non-vacuum ultrasonic spray pyrolysis deposition (USPD) technique. Good source/drain ohmic contacts were obtained by devising an Mg-doped p++-GaN capper. Enhanced two-dimension hole gas (2DHG) characteristics and current densities have also been achieved by the devised p-GaN/GaN/AlN/Al0.3Ga0.7N heterostructure. The present p-channel GaN MOS-HFET design with (without) DFP has demonstrated superior on/off current ratio (Ion/Ioff) of 2 × 106 (9.2 × 105), maximum drain-source current density (IDS, max) of -9.5 (-10.6) mA/mm at VDS = 20 V, two-terminal off-state gate-drain breakdown voltage (BVGD) of 710 (520) V, and BVDS of -735 (-545) V, respectively. The present design is suitable for applications in high-voltage complementary power-switching circuits of electric vehicle (EV) electronics. |
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ISSN: | 2168-6734 |
DOI: | 10.1109/JEDS.2023.3294911 |