Enabling the Use of High Precision Glass Wafers in a Conventional Si Fab

Glass has unique properties that make it attractive for many applications. Combining glass with Si fabrication process would create new possibilities not only in device performance and form factor, but also scale economies. Key challenges in using glass wafers in a Si fab include lack of opacity and...

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Bibliographic Details
Published in:IEEE transactions on semiconductor manufacturing 2023-08, Vol.36 (3), p.1-1
Main Authors: Zhang, Jay, Ng, Chee-Hau, Kouassi, Sebastien
Format: Article
Language:English
Subjects:
Bonding
Coatings
Conductivity
contamination
Electrical resistivity
Form factors
Glass
glass wafers
Laser beams
Metals
opacification
Si fab
Silicon
Smoothness
Wafers
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Summary:Glass has unique properties that make it attractive for many applications. Combining glass with Si fabrication process would create new possibilities not only in device performance and form factor, but also scale economies. Key challenges in using glass wafers in a Si fab include lack of opacity and electrical conductivity as well as metallic and particle contamination. These challenges can be overcome through a suitable coating on the glass wafer and rigorous particle removal throughput the fabrication and use process. For applications that demand high precision to support direct wafer bonding and lithography, glass wafers can be engineered to deliver the required surface smoothness and flatness.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2023.3276165