Substrate effects in hysteresis of microscale Ni–Mn–Sn Heusler alloy films

During martensitic phase transformations in thin films, substrates impact hysteresis by introducing an additional interface, which can inhibit martensite/austenite interface motion. In order to reduce hysteresis, we examine 2.9–14.5 μm thick Ni–Mn–Sn films, which in some cases have been delaminated...

Full description

Saved in:
Bibliographic Details
Published in:Applied physics letters 2023-08, Vol.123 (7)
Main Authors: Zhang, Yijia, Zhao, Dexin, Lago, Juan C., Xie, Kelvin, Shamberger, Patrick J.
Format: Article
Language:English
Subjects:
Applied physics
Austenite
Defect annealing
Delamination
Friction resistance
Heusler alloys
Hysteresis
Manganese
Martensite
Nickel
Phase transitions
Substrates
Thermal expansion
Thick films
Thin films
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:During martensitic phase transformations in thin films, substrates impact hysteresis by introducing an additional interface, which can inhibit martensite/austenite interface motion. In order to reduce hysteresis, we examine 2.9–14.5 μm thick Ni–Mn–Sn films, which in some cases have been delaminated from the substrates before or after annealing. We compare thermal hysteresis and defect densities at the interface. Delaminating films prior to annealing decreases hysteresis, whereas delaminating films after annealing does not significantly impact hysteresis. Substrate effects are attributed to the thermal expansion mismatch between the film and substrate, resulting in the formation of dislocations at the interface and, consequentially, an increase in frictional resistance to martensite/austenite interface motion.
ISSN:0003-6951
1077-3118
DOI:10.1063/5.0159129