PCB solder mask coverage over conductors (skip coverage) problem solving using Ishikawa method

Printed Circuit Board (PCB) is used widely in electronics industry. One of the critical parts of PCB manufacturing process is solder mask application. The IPC standard is used as acceptance criteria for PCB solder mask coverage over conductors (skip coverage) defect in Teaching Factory Manufacturing...

Full description

Saved in:
Bibliographic Details
Main Authors: Asaad, Nur Sakinah, Mustanir, Anggraini, Diana
Format: Conference Proceeding
Language:English
Subjects:
Acceptance criteria
Circuit boards
Conductors
Defects
Electronics
Manufacturing
Printed circuits
Problem solving
Root cause analysis
Screen printing
Solders
Thickness
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Printed Circuit Board (PCB) is used widely in electronics industry. One of the critical parts of PCB manufacturing process is solder mask application. The IPC standard is used as acceptance criteria for PCB solder mask coverage over conductors (skip coverage) defect in Teaching Factory Manufacturing of Electronics (TFME), Politeknik Negeri Batam. The PCB used in this research is rigid PCB FR4. Solder mask application method is screen printing with thermal curing. To solve the defect, fishbone diagram (Ishikawa diagram) has been made with three potential problems breakdown before being analyzed with and 5-why techniques. This method is used to define the root cause for the potential problems. Corrective actions are made for all the root causes before it continues the validation run with the proposed parameters done. The PCB are inspected 100% by microscope with 40X magnification and sampling method using micrometer for solder mask thickness. The results showed that there were no longer skip coverage defect present. The solder mask thickness can meet the acceptance criteria a minimum of 25 µm based on IPC standard.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0126277