Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration

A micro-patterned dry film (MPDF) bonding method based on an advanced glass packaging process is developed for the fabrication and integration of millimeter-wave (mm-W) devices. Owing to the reduction of contact areas between dry films and substrates, the MPDF achieved by lithography technology can...

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Bibliographic Details
Published in:IEEE electron device letters 2023-11, Vol.44 (11), p.1873-1876
Main Authors: Cai, Jing, Zhou, Qing, Zhang, Miao, Wu, Shu Yue, Yu, Daquan, Liu, Qing Huo
Format: Article
Language:English
Subjects:
Adhesive bonding
advanced glass packaging
Bonding
Dry film
Electric contacts
Electrical properties
gap waveguide
Glass
micro patterns
Millimeter waves
mm-W device integration
Packaging
Plastics
Radio frequency
Substrates
Surface treatment
Waveguides
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Summary:A micro-patterned dry film (MPDF) bonding method based on an advanced glass packaging process is developed for the fabrication and integration of millimeter-wave (mm-W) devices. Owing to the reduction of contact areas between dry films and substrates, the MPDF achieved by lithography technology can effectively mitigate the formation of voids during traditional adhesive bonding and negative impact of polymers on electrical properties. The dependence of void-free behaviors and electrical properties on various micro patterns is investigated. For demonstration, a V-band glass-based double-sided gap waveguide is fabricated by the proposed MPDF bonding. The measured S-parameters are consistent with the simulated ones. It is verified that the proposed MPDF bonding can deal with complex bonding surfaces and can be successfully applied in the fabrication and integration of mm-W and THz devices.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2023.3314408