Loading…

Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector

We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metalli...

Full description

Saved in:
Bibliographic Details
Published in:IEEE photonics technology letters 2023-12, Vol.35 (24), p.1387-1390
Main Authors: Wan, Chuiming, Zeng, Zhaoming, Xiao, Guowei, Lan, Yian, Li, Chencheng, Lin, Hongwei, Wang, Hong
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953
cites cdi_FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953
container_end_page 1390
container_issue 24
container_start_page 1387
container_title IEEE photonics technology letters
container_volume 35
creator Wan, Chuiming
Zeng, Zhaoming
Xiao, Guowei
Lan, Yian
Li, Chencheng
Lin, Hongwei
Wang, Hong
description We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.
doi_str_mv 10.1109/LPT.2023.3325394
format article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2887108397</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>10287371</ieee_id><sourcerecordid>2887108397</sourcerecordid><originalsourceid>FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</originalsourceid><addsrcrecordid>eNpNkL1PwzAQxS0EEqWwMzBYYk65sx0SjygEqJQKhNoyRm5sQ6okDkmKCH89rsrAdE-n9-7jR8glwgwR5E32spwxYHzGOQu5FEdkglJgABiJY6_Ba0QenpKzvt8CoAi5mJB1am1ZlKYpRjqv2859mdo0A3WWrtYJzdL7nm5Gmrbue6QLV-myeaeJq1u3azR9K4cPujCDqqryx2j6amxlisF15-TEqqo3F391SlYP6TJ5CrLnx3lylwUFk2wItIUCpAw1j6W0KEFzlBujVciUfwMtFgysVrfCRpHyLcAQELhvC6FkyKfk-jDXX_65M_2Qb92ua_zKnMVxhBBzGXkXHFxF5_q-MzZvu7JW3Zgj5Ht6uaeX7-nlf_R85OoQKY0x_-wsjniE_BdgMmnF</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2887108397</pqid></control><display><type>article</type><title>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</title><source>IEEE Xplore (Online service)</source><creator>Wan, Chuiming ; Zeng, Zhaoming ; Xiao, Guowei ; Lan, Yian ; Li, Chencheng ; Lin, Hongwei ; Wang, Hong</creator><creatorcontrib>Wan, Chuiming ; Zeng, Zhaoming ; Xiao, Guowei ; Lan, Yian ; Li, Chencheng ; Lin, Hongwei ; Wang, Hong</creatorcontrib><description>We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</description><identifier>ISSN: 1041-1135</identifier><identifier>EISSN: 1941-0174</identifier><identifier>DOI: 10.1109/LPT.2023.3325394</identifier><identifier>CODEN: IPTLEL</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Ceramics ; deep ultraviolet light-emitting diodes (DUV-LEDs) ; Electromagnetic compatibility ; epoxy molding compound (EMC) ; Light emitting diodes ; Light extraction ; metallized reflector ; Metallizing ; Molding compounds ; Photonics ; Power generation ; Reliability ; Substrates ; Thermal resistance ; Ultraviolet radiation</subject><ispartof>IEEE photonics technology letters, 2023-12, Vol.35 (24), p.1387-1390</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</citedby><cites>FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</cites><orcidid>0009-0004-5817-3331 ; 0000-0002-8875-0521</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10287371$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,777,781,27905,27906,54777</link.rule.ids></links><search><creatorcontrib>Wan, Chuiming</creatorcontrib><creatorcontrib>Zeng, Zhaoming</creatorcontrib><creatorcontrib>Xiao, Guowei</creatorcontrib><creatorcontrib>Lan, Yian</creatorcontrib><creatorcontrib>Li, Chencheng</creatorcontrib><creatorcontrib>Lin, Hongwei</creatorcontrib><creatorcontrib>Wang, Hong</creatorcontrib><title>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</title><title>IEEE photonics technology letters</title><addtitle>LPT</addtitle><description>We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</description><subject>Ceramics</subject><subject>deep ultraviolet light-emitting diodes (DUV-LEDs)</subject><subject>Electromagnetic compatibility</subject><subject>epoxy molding compound (EMC)</subject><subject>Light emitting diodes</subject><subject>Light extraction</subject><subject>metallized reflector</subject><subject>Metallizing</subject><subject>Molding compounds</subject><subject>Photonics</subject><subject>Power generation</subject><subject>Reliability</subject><subject>Substrates</subject><subject>Thermal resistance</subject><subject>Ultraviolet radiation</subject><issn>1041-1135</issn><issn>1941-0174</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNpNkL1PwzAQxS0EEqWwMzBYYk65sx0SjygEqJQKhNoyRm5sQ6okDkmKCH89rsrAdE-n9-7jR8glwgwR5E32spwxYHzGOQu5FEdkglJgABiJY6_Ba0QenpKzvt8CoAi5mJB1am1ZlKYpRjqv2859mdo0A3WWrtYJzdL7nm5Gmrbue6QLV-myeaeJq1u3azR9K4cPujCDqqryx2j6amxlisF15-TEqqo3F391SlYP6TJ5CrLnx3lylwUFk2wItIUCpAw1j6W0KEFzlBujVciUfwMtFgysVrfCRpHyLcAQELhvC6FkyKfk-jDXX_65M_2Qb92ua_zKnMVxhBBzGXkXHFxF5_q-MzZvu7JW3Zgj5Ht6uaeX7-nlf_R85OoQKY0x_-wsjniE_BdgMmnF</recordid><startdate>20231215</startdate><enddate>20231215</enddate><creator>Wan, Chuiming</creator><creator>Zeng, Zhaoming</creator><creator>Xiao, Guowei</creator><creator>Lan, Yian</creator><creator>Li, Chencheng</creator><creator>Lin, Hongwei</creator><creator>Wang, Hong</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0009-0004-5817-3331</orcidid><orcidid>https://orcid.org/0000-0002-8875-0521</orcidid></search><sort><creationdate>20231215</creationdate><title>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</title><author>Wan, Chuiming ; Zeng, Zhaoming ; Xiao, Guowei ; Lan, Yian ; Li, Chencheng ; Lin, Hongwei ; Wang, Hong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Ceramics</topic><topic>deep ultraviolet light-emitting diodes (DUV-LEDs)</topic><topic>Electromagnetic compatibility</topic><topic>epoxy molding compound (EMC)</topic><topic>Light emitting diodes</topic><topic>Light extraction</topic><topic>metallized reflector</topic><topic>Metallizing</topic><topic>Molding compounds</topic><topic>Photonics</topic><topic>Power generation</topic><topic>Reliability</topic><topic>Substrates</topic><topic>Thermal resistance</topic><topic>Ultraviolet radiation</topic><toplevel>online_resources</toplevel><creatorcontrib>Wan, Chuiming</creatorcontrib><creatorcontrib>Zeng, Zhaoming</creatorcontrib><creatorcontrib>Xiao, Guowei</creatorcontrib><creatorcontrib>Lan, Yian</creatorcontrib><creatorcontrib>Li, Chencheng</creatorcontrib><creatorcontrib>Lin, Hongwei</creatorcontrib><creatorcontrib>Wang, Hong</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE photonics technology letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wan, Chuiming</au><au>Zeng, Zhaoming</au><au>Xiao, Guowei</au><au>Lan, Yian</au><au>Li, Chencheng</au><au>Lin, Hongwei</au><au>Wang, Hong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</atitle><jtitle>IEEE photonics technology letters</jtitle><stitle>LPT</stitle><date>2023-12-15</date><risdate>2023</risdate><volume>35</volume><issue>24</issue><spage>1387</spage><epage>1390</epage><pages>1387-1390</pages><issn>1041-1135</issn><eissn>1941-0174</eissn><coden>IPTLEL</coden><abstract>We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LPT.2023.3325394</doi><tpages>4</tpages><orcidid>https://orcid.org/0009-0004-5817-3331</orcidid><orcidid>https://orcid.org/0000-0002-8875-0521</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 1041-1135
ispartof IEEE photonics technology letters, 2023-12, Vol.35 (24), p.1387-1390
issn 1041-1135
1941-0174
language eng
recordid cdi_proquest_journals_2887108397
source IEEE Xplore (Online service)
subjects Ceramics
deep ultraviolet light-emitting diodes (DUV-LEDs)
Electromagnetic compatibility
epoxy molding compound (EMC)
Light emitting diodes
Light extraction
metallized reflector
Metallizing
Molding compounds
Photonics
Power generation
Reliability
Substrates
Thermal resistance
Ultraviolet radiation
title Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T12%3A08%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Efficiency%20Improvement%20of%20UVC%20LEDs%20by%20Epoxy%20Molding%20Compound%20With%20Metallized%20Reflector&rft.jtitle=IEEE%20photonics%20technology%20letters&rft.au=Wan,%20Chuiming&rft.date=2023-12-15&rft.volume=35&rft.issue=24&rft.spage=1387&rft.epage=1390&rft.pages=1387-1390&rft.issn=1041-1135&rft.eissn=1941-0174&rft.coden=IPTLEL&rft_id=info:doi/10.1109/LPT.2023.3325394&rft_dat=%3Cproquest_cross%3E2887108397%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2887108397&rft_id=info:pmid/&rft_ieee_id=10287371&rfr_iscdi=true