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Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector
We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metalli...
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Published in: | IEEE photonics technology letters 2023-12, Vol.35 (24), p.1387-1390 |
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container_issue | 24 |
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container_title | IEEE photonics technology letters |
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creator | Wan, Chuiming Zeng, Zhaoming Xiao, Guowei Lan, Yian Li, Chencheng Lin, Hongwei Wang, Hong |
description | We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively. |
doi_str_mv | 10.1109/LPT.2023.3325394 |
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From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</description><identifier>ISSN: 1041-1135</identifier><identifier>EISSN: 1941-0174</identifier><identifier>DOI: 10.1109/LPT.2023.3325394</identifier><identifier>CODEN: IPTLEL</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Ceramics ; deep ultraviolet light-emitting diodes (DUV-LEDs) ; Electromagnetic compatibility ; epoxy molding compound (EMC) ; Light emitting diodes ; Light extraction ; metallized reflector ; Metallizing ; Molding compounds ; Photonics ; Power generation ; Reliability ; Substrates ; Thermal resistance ; Ultraviolet radiation</subject><ispartof>IEEE photonics technology letters, 2023-12, Vol.35 (24), p.1387-1390</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2023</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</citedby><cites>FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</cites><orcidid>0009-0004-5817-3331 ; 0000-0002-8875-0521</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10287371$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,777,781,27905,27906,54777</link.rule.ids></links><search><creatorcontrib>Wan, Chuiming</creatorcontrib><creatorcontrib>Zeng, Zhaoming</creatorcontrib><creatorcontrib>Xiao, Guowei</creatorcontrib><creatorcontrib>Lan, Yian</creatorcontrib><creatorcontrib>Li, Chencheng</creatorcontrib><creatorcontrib>Lin, Hongwei</creatorcontrib><creatorcontrib>Wang, Hong</creatorcontrib><title>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</title><title>IEEE photonics technology letters</title><addtitle>LPT</addtitle><description>We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</description><subject>Ceramics</subject><subject>deep ultraviolet light-emitting diodes (DUV-LEDs)</subject><subject>Electromagnetic compatibility</subject><subject>epoxy molding compound (EMC)</subject><subject>Light emitting diodes</subject><subject>Light extraction</subject><subject>metallized reflector</subject><subject>Metallizing</subject><subject>Molding compounds</subject><subject>Photonics</subject><subject>Power generation</subject><subject>Reliability</subject><subject>Substrates</subject><subject>Thermal resistance</subject><subject>Ultraviolet radiation</subject><issn>1041-1135</issn><issn>1941-0174</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2023</creationdate><recordtype>article</recordtype><recordid>eNpNkL1PwzAQxS0EEqWwMzBYYk65sx0SjygEqJQKhNoyRm5sQ6okDkmKCH89rsrAdE-n9-7jR8glwgwR5E32spwxYHzGOQu5FEdkglJgABiJY6_Ba0QenpKzvt8CoAi5mJB1am1ZlKYpRjqv2859mdo0A3WWrtYJzdL7nm5Gmrbue6QLV-myeaeJq1u3azR9K4cPujCDqqryx2j6amxlisF15-TEqqo3F391SlYP6TJ5CrLnx3lylwUFk2wItIUCpAw1j6W0KEFzlBujVciUfwMtFgysVrfCRpHyLcAQELhvC6FkyKfk-jDXX_65M_2Qb92ua_zKnMVxhBBzGXkXHFxF5_q-MzZvu7JW3Zgj5Ht6uaeX7-nlf_R85OoQKY0x_-wsjniE_BdgMmnF</recordid><startdate>20231215</startdate><enddate>20231215</enddate><creator>Wan, Chuiming</creator><creator>Zeng, Zhaoming</creator><creator>Xiao, Guowei</creator><creator>Lan, Yian</creator><creator>Li, Chencheng</creator><creator>Lin, Hongwei</creator><creator>Wang, Hong</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0009-0004-5817-3331</orcidid><orcidid>https://orcid.org/0000-0002-8875-0521</orcidid></search><sort><creationdate>20231215</creationdate><title>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</title><author>Wan, Chuiming ; Zeng, Zhaoming ; Xiao, Guowei ; Lan, Yian ; Li, Chencheng ; Lin, Hongwei ; Wang, Hong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c292t-df0c0995d3899f190d319beda52a3251f1c20fda64f77aa3201501031c244a953</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Ceramics</topic><topic>deep ultraviolet light-emitting diodes (DUV-LEDs)</topic><topic>Electromagnetic compatibility</topic><topic>epoxy molding compound (EMC)</topic><topic>Light emitting diodes</topic><topic>Light extraction</topic><topic>metallized reflector</topic><topic>Metallizing</topic><topic>Molding compounds</topic><topic>Photonics</topic><topic>Power generation</topic><topic>Reliability</topic><topic>Substrates</topic><topic>Thermal resistance</topic><topic>Ultraviolet radiation</topic><toplevel>online_resources</toplevel><creatorcontrib>Wan, Chuiming</creatorcontrib><creatorcontrib>Zeng, Zhaoming</creatorcontrib><creatorcontrib>Xiao, Guowei</creatorcontrib><creatorcontrib>Lan, Yian</creatorcontrib><creatorcontrib>Li, Chencheng</creatorcontrib><creatorcontrib>Lin, Hongwei</creatorcontrib><creatorcontrib>Wang, Hong</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE photonics technology letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wan, Chuiming</au><au>Zeng, Zhaoming</au><au>Xiao, Guowei</au><au>Lan, Yian</au><au>Li, Chencheng</au><au>Lin, Hongwei</au><au>Wang, Hong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector</atitle><jtitle>IEEE photonics technology letters</jtitle><stitle>LPT</stitle><date>2023-12-15</date><risdate>2023</risdate><volume>35</volume><issue>24</issue><spage>1387</spage><epage>1390</epage><pages>1387-1390</pages><issn>1041-1135</issn><eissn>1941-0174</eissn><coden>IPTLEL</coden><abstract>We propose an epoxy molding compound (EMC) encapsulation method based on a metallized reflector to enhance light extraction of deep ultraviolet light-emitting diodes (DUV-LEDs). From the optical simulation, the highest light output efficiency of the DUV-LEDs is measured when the angle of the metallied reflector is 35° and the height is 0.5-mm. The optimized EMC structure is fabricated for application to DUV-LEDs packaging. The light output power of the EMC metallized reflector is improved by 14.3% compared to the conventional ceramic package at 20-mA. The thermal resistance of the EMC is 18.16-K/W. Furthermore, after aging tests at 60 °C and 60 °C, 90 %RH for 1000h, the relative light output power of the EMC metallized reflector is decreased by 12% and 14%, respectively.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LPT.2023.3325394</doi><tpages>4</tpages><orcidid>https://orcid.org/0009-0004-5817-3331</orcidid><orcidid>https://orcid.org/0000-0002-8875-0521</orcidid></addata></record> |
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subjects | Ceramics deep ultraviolet light-emitting diodes (DUV-LEDs) Electromagnetic compatibility epoxy molding compound (EMC) Light emitting diodes Light extraction metallized reflector Metallizing Molding compounds Photonics Power generation Reliability Substrates Thermal resistance Ultraviolet radiation |
title | Efficiency Improvement of UVC LEDs by Epoxy Molding Compound With Metallized Reflector |
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