Two‐Dimensional Semiconductors: From Device Processing to Circuit Integration

• Published in: Advanced functional materials 2023-12, Vol.33 (50), p.n/a
• Main Authors: Sheng, Chuming, Dong, Xiangqi, Zhu, Yuxuan, Wang, Xinyu, Chen, Xinyu, Xia, Yin, Xu, Zihan, Zhou, Peng, Wan, Jing, Bao, Wenzhong
• Format: Article
• Language: English
• Subjects: 2D materials; circuit applications; Electrical properties; Integrated circuits; Manufacturing; Materials science; process integration; transistors; Two dimensional materials
• ISSN: 1616-301X; 1616-3028
• DOI: 10.1002/adfm.202304778

The atomically thin nature and exceptional electrical properties of 2D materials (2DMs) have garnered significant interest in circuit applications. Researchers have developed circuits based on wafer‐level 2DM fabrication and monolithic integration in the laboratory. Numerous studies have been conducted on discrete device processes; however, circuit manufacturing is a multifaceted and methodical engineering process that demands seamless integration of multiple procedures. Notably, the optimization of crucial processes holds paramount significance in achieving expected results. This review presents the existing research on process integration of 2DM devices and circuit applications. The selection of suitable 2DMs for circuit applications is outlined, considering their excellent theoretical properties and feasible high‐quality growth processes. Drawing on highly mature semiconductor manufacturing process, while incorporating customized key processes, 2DM devices have the potential to strongly compete with, and even outperform, the conventional devices. Finally, the recent circuit applications of 2DMs are also discussed in detail. 2DM integrated circuits (2DM ICs) are now being practically applied in advanced manufacturing, transitioning from laboratory development to fabrication plant deployment. The implementation of underlying 2DM IC fabrication provides effective and unique solutions for More Moore, More than Moore, and Beyond CMOS technology routes. The wafer‐scale synthesis and device processing of 2D materials (2DMs) for integrated circuit applications are reviewed, emphasizing the criticality of process integration towards practical manufacturing. The feasibility of transitioning from laboratory research to industrial‐scale utilization is also discussed, while identifying potential integration issues that need to be addressed.