Circuit Models for Interconnects Using 3D Computational Techniques

This paper presents a method to generate circuit models from 3D distributed structures. In the first step a broadband characterization of the device is obtained through a reduced order modeling technique. Then in the second step a rational approximation of the coefficients of the impedance matrix is...

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Bibliographic Details
Published in:Applied Computational Electromagnetics Society journal 2008-03, Vol.23 (1), p.39
Main Authors: Essakhi, B, Benel, J, Smail, M, Pichon, L, Akoun, G
Format: Article
Language:English
Subjects:
Broadband
Cables
Equivalent circuits
Impedance matrix
Interconnections
Reduced order models
Three dimensional models
Online Access:Get full text
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Summary:This paper presents a method to generate circuit models from 3D distributed structures. In the first step a broadband characterization of the device is obtained through a reduced order modeling technique. Then in the second step a rational approximation of the coefficients of the impedance matrix is derived using a root mean squared procedure. An equivalent circuit is then synthesized and allows a global circuit simulation of the whole structure. The proposed methodology can be used with a segmentation technique for the analysis of complex structures: a whole 3D structure can be subdivided into smaller parts. Each part is characterized by an equivalent circuit deduced from wideband analysis. The connection between the substructures makes available a global simulation of the whole system inside a circuit platform (SPICE for example). Numerical results are shown for different kinds of interconnects (tracks and cables).
ISSN:1054-4887
1943-5711