Design of an SOI-MEMS high resolution capacitive type single axis accelerometer

In recent years, high resolution micro accelerometers are increasingly finding various applications in different segments of life. The current work deals with the design of a high resolution single axis accelerometer based on SOI-MEMS technology. Accordingly two different approaches for designing co...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2010-12, Vol.16 (12), p.2057-2066
Main Authors: Mistry, Kalyan Kumar, Swamy, K. B. M., Sen, Siddhartha
Format: Article
Language:English
Subjects:
Accelerometers
Applied sciences
Design
Design optimization
Design parameters
Electronics
Electronics and Microelectronics
Engineering
Exact sciences and technology
Finite element method
High resolution
Instrumentation
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical Engineering
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectromechanical systems
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Nanotechnology
Noise levels
Noise sensitivity
Parameter sensitivity
Physics
Precision engineering, watch making
Resonant frequencies
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
SOI (semiconductors)
Technical Paper
Thin films
Three dimensional models
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Summary:In recent years, high resolution micro accelerometers are increasingly finding various applications in different segments of life. The current work deals with the design of a high resolution single axis accelerometer based on SOI-MEMS technology. Accordingly two different approaches for designing comb type, capacitive, SOI-MEMS accelerometer is presented. Initially a system level approach using a simulation platform from SABER is carried out to obtain the basic design. Later, a device level design is carried out by building three dimensional (3D) geometric models using finite element (FE) simulations through CoventorWare software. Different design parameters like mechanical and electrical sensitivity, capacitance values, resonant frequency, etc. are obtained in either of the cases and compared. The design is optimized based on the overall sensitivity and the system noise level both electrical and mechanical, respectively. The complete design is worked out in accordance with the silicon on insulator based multiuser MEMS fabrication processes (MUMPs) technology from MEMSCAP foundry.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-010-1146-1