Nonlinear buckling analysis of vertical wafer probe technology

Due to the demand of the industry for an increase of the number of I/Os, while decreasing the die size, the bond pads had to shrink and design restrictions for the active structures underneath had to fall. This leads to new challenges for the electrical probing and the mechanical robustness of the u...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2010-11, Vol.16 (11), p.1909-1920
Main Authors: Hauck, Torsten, Müller, Wolfgang H., Schmadlak, Ilko
Format: Article
Language:English
Subjects:
Applied sciences
Buckling
Closed form solutions
Computer simulation
Deformation
Electronics
Electronics and Microelectronics
Engineering
Exact sciences and technology
Exact solutions
Instrumentation
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mathematical analysis
Mechanical Engineering
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Nanotechnology
Physics
Precision engineering, watch making
Robustness (mathematics)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Small mammals
Technical Paper
Testing, measurement, noise and reliability
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Summary:Due to the demand of the industry for an increase of the number of I/Os, while decreasing the die size, the bond pads had to shrink and design restrictions for the active structures underneath had to fall. This leads to new challenges for the electrical probing and the mechanical robustness of the under-pad structures. This paper presents analytical and numerical simulation approaches for predicting the force/travel relation of buckling beam-probes that are used for testing the electrical functionality of back-end-of-line (BEOL) interconnect system underneath a chip pad. For this purpose we investigate, first, in a closed-form manner, the elastic stability of the probe needle according to the large deflection theory of buckled bars. Second, we determine, for a specific geometry of the beam, the probe forces as functions of the probe card overdrive by using the closed-form methods as well as finite-element simulations. The results are finally compared to that obtained in (probe card) experiments.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-010-1115-8