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Influence of particle size on physical, mechanical, thermal, and morphological properties of tamarind- fenugreek mucilage biodegradable films

The preparation of biodegradable films using, tamarind seed powder (TSP) and fenugreek seed powder (FSP) has been reported herein. The tamarind seed powder (TSP) was used to prepare pure films as T1, T2 and T3, based on particle size Grade-I, II and III, similarly, FSP films were prepared as F1, F2...

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Bibliographic Details
Published in:Polymer bulletin (Berlin, Germany) Germany), 2023-03, Vol.80 (3), p.3119-3133
Main Authors: Mishra, Anuradha, Mohite, Ashish M., Sharma, Neha
Format: Article
Language:English
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Summary:The preparation of biodegradable films using, tamarind seed powder (TSP) and fenugreek seed powder (FSP) has been reported herein. The tamarind seed powder (TSP) was used to prepare pure films as T1, T2 and T3, based on particle size Grade-I, II and III, similarly, FSP films were prepared as F1, F2 and F3, whereas composite films from (TSP and FSP) were prepared with (50:50) ratio based on above grades were as TF1, TF2 and TF3, respectively. The textural properties of the films prepared from pure TSP as T1; pure (FSP) as F1 and composite films of TSP and FSP as TF1 were found to be better than that of other films. The heat capacity (Hc), determined using DSC, was found in the range of 0.089–2.260 kgm 2 /ks 2 for all the films. The microbial analysis performed using the Aerobic colony count and Yeast and mold count methods showed the least microbial count for the film containing FSP due to the anti-microbial properties of fenugreek. The SEM analysis found smoother surfaces with the closeness of pores for T1, F1 and TF1 films. The Water vapor permeability was in the range of 0.49–0.82 mg/Pa.s.m 2  × 10 –11 . The evaluation of the biodegradability of the films was done by soil burial test, and intrinsic viscosity measurements at different time intervals were found better results for T1, F1 and TF1 films. Pure TSP and pure FSP films with Grade I mucilage found better for packaging application.
ISSN:0170-0839
1436-2449
DOI:10.1007/s00289-022-04214-1