Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

Adhesive wafer bonding is a technique that uses an intermediate layer (typically a polymer) for bonding two substrates. The main advantages of using this approach are: low temperature processing (maximum temperatures lower than 400°C), surface planarization and tolerance to particles contamination (...

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Bibliographic Details
Published in:Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2010-05, Vol.16 (5), p.799-808
Main Authors: Cakmak, Erkan, Dragoi, Viorel, Capsuto, Elliott, McEwen, Craig, Pabo, Eric
Format: Article
Language:English
Subjects:
Adhesive bonding
Adhesives
Bond strength
Design of experiments
Diameters
Electronics and Microelectronics
Engineering
Factorial experiments
Instrumentation
Low temperature
Mechanical Engineering
Modulus of elasticity
Nanotechnology
Photolithography
Photosensitivity
Polymers
Process parameters
Statistical analysis
Statistical methods
Substrates
Technical Paper
Thermal stability
Thickness
Ultraviolet radiation
Variance analysis
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Summary:Adhesive wafer bonding is a technique that uses an intermediate layer (typically a polymer) for bonding two substrates. The main advantages of using this approach are: low temperature processing (maximum temperatures lower than 400°C), surface planarization and tolerance to particles contamination (the intermediate layer can incorporate particles with the diameter in the layer thickness range). The main bonding layers properties required by a large field of applications/designs can be summarized as: isotropic dielectric constants, good thermal stability, low Young’s modulus, and good adhesion to different substrates. This paper reports on wafer-to-wafer adhesive bonding using SINR TM polymer materials. Substrate coating process as well as wafer bonding process parameters optimization was studied. Statistical analysis methods were used to show repeatability and reliability of coating processes. Features of as low as 15 μm size were successfully resolved by photolithography and bonded. An unique megasonic-enhanced development process of the patterned film using low cost solvent was established and proven to exceed standard development method performance.
ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-009-0977-0