Experimental characterization and modeling of power module warpage during assembly process

Hybrid and full electric automotive market is strongly increasing the demand for power semiconductor modules. With respect to discrete packages, manufacturing of power modules is more complex and new process parameter, such as module deformation (warpage), assumes a key role for a robust design and...

Full description

Saved in:
Bibliographic Details
Published in:International journal on interactive design and manufacturing 2021-03, Vol.15 (1), p.113-115
Main Authors: Calabretta, Michele, Sitta, Alessandro, Oliveri, Salvatore Massimo, Sequenzia, Gaetano
Format: Article
Language:English
Subjects:
Assembly
Automobile industry
Automotive materials
CAE) and Design
Computer-Aided Engineering (CAD
Cooling
Copper
Deformation
Electronics and Microelectronics
Engineering
Engineering Design
Finite element method
Heat
Industrial Design
Instrumentation
International conferences
Mathematical models
Mechanical Engineering
Modules
Packaging
Phenomenology
Process parameters
Robust design
Short Original Paper
Simulation
Warpage
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Hybrid and full electric automotive market is strongly increasing the demand for power semiconductor modules. With respect to discrete packages, manufacturing of power modules is more complex and new process parameter, such as module deformation (warpage), assumes a key role for a robust design and to guarantee reliable application. The aim of this paper is to study the warpage behaviour during power module assembly flow by means of dedicated warpage measurement at different process steps. Once highlighted the most impacting process for warpage, a finite element model has been developed to reproduce phenomenology, predicting the induced deformation.
ISSN:1955-2513
1955-2505
DOI:10.1007/s12008-020-00735-z