The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging

The mechanical properties of electronic devices in packaging technology are significantly affected by intermetallic compounds (IMCs). This study investigates the interfacial reaction between Ni under bump metallization and In solder at aging temperatures of 125°C, 135°C, and 145°C for different peri...

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Bibliographic Details
Published in:Journal of electronic materials 2024-03, Vol.53 (3), p.1264-1271
Main Authors: Wang, Yu-Chieh, Ouyang, Fan-Yi
Format: Article
Language:English
Subjects:
Aging
Aging (metallurgy)
Characterization and Evaluation of Materials
Chemistry and Materials Science
Electronic packaging
Electronic Packaging and Interconnections 2023
Electronics and Microelectronics
Instrumentation
Interface reactions
Intermetallic compounds
Materials Science
Mechanical properties
Metallizing
Morphology
Optical and Electronic Materials
Sandwich structures
Silicon wafers
Solid State Physics
Temperature
Topical Collection: Electronic Packaging and Interconnections 2023
X-ray spectroscopy
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Summary:The mechanical properties of electronic devices in packaging technology are significantly affected by intermetallic compounds (IMCs). This study investigates the interfacial reaction between Ni under bump metallization and In solder at aging temperatures of 125°C, 135°C, and 145°C for different periods. Based on the energy dispersive x-ray spectrometry analysis, the growth of the IMCs is mainly Ni 3 In 7 . In addition, the square thickness of the IMCs is proportional to the aging time, which is consistent with volume diffusion control. The activation energy of the Ni 3 In 7 IMC is calculated as 165.9 kJ/mol.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-023-10865-1