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Effects of solidification, solution and aging processes on an AlCuNb alloy: thermal and microstructural analysis, microhardness, electrical resistivity and conductivity
This paper analyzes the effect of both solidification and heat treatment process on microstructure, microhardness, electrical resistivity and electrical conductivity ( ρ and σ ) in an Al–3Cu–5Nb alloy (mass/%). In this sense, an unsteady-state horizontal solidification experiment was carried out usi...
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Published in: | Journal of thermal analysis and calorimetry 2024-02, Vol.149 (3), p.953-966 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | This paper analyzes the effect of both solidification and heat treatment process on microstructure, microhardness, electrical resistivity and electrical conductivity (
ρ
and
σ
) in an Al–3Cu–5Nb alloy (mass/%). In this sense, an unsteady-state horizontal solidification experiment was carried out using a water-cooled solidification device and as-cast samples were subjected to various T6-type heat treatment conditions. The solidification thermal parameters investigated were the growth and cooling rates (
V
L
and
T
R
), and those of the thermal treatment were the temperatures and times in the solution and aging stages. Techniques by optical and scanning electron microscopy differential scanning calorimetry (DSC) and X-ray diffractometry (XRD) were applied for microstructural and thermal analysis. The DSC results showed the plateau corresponding to the beginning and end of the formation of the Al-rich solid solution (Alα), indicated by the
T
Lα
and
T
S
/eutectic temperatures of the alloy (~ 645 °C and ~ 530 °C). An increase in the HV values with the application of the T6-heat treatment in the as-cast samples was observed for all assumed conditions and the best condition found was for 500 °C/3 h of solution, and 155 °C/5 h for the aging in which the hardness increased from 61.4 to 90.33 HV, equivalent to the increase of ~ 47%. It was observed that macrostructure consisting of columnar grains favor electric current flow contributing to the decrease of
ρ
, as a consequence increased
σ
. For the total length of the ingot, the electrical conductivity increased from 23.8 × 10
6
S m
−1
in the solidified conditions to 40.1 × 10
6
S m
−1
(~ 68.5%) in the T6 conditions equal to 490 °C/3 h and 155 °C/3 h in the solution and aging stages, respectively, as well as higher
σ
values were found in the region formed by columnar grains in which higher
V
L
and
T
R
values and lower secondary dendritic spacing (
λ
2
) were obtained. |
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ISSN: | 1388-6150 1588-2926 |
DOI: | 10.1007/s10973-023-12739-4 |