Stress Study on CrN Thin Films with Different Thicknesses on Stainless Steel

The reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa u...

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Bibliographic Details
Published in:Acta metallurgica sinica : English letters 2018-03, Vol.31 (3), p.329-336
Main Authors: Fan, Di, Lei, Hao, Guo, Chao-Qian, Qi, Dong-Li, Gong, Jun, Sun, Chao
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Corrosion and Coatings
Error analysis
High temperature
Materials Science
Measurement methods
Mechanical properties
Metallic Materials
Nanotechnology
Organometallic Chemistry
Protective coatings
Residual stress
Silicon
Silicon wafers
Spectroscopy/Spectrometry
Stainless steel
Stainless steels
Stress measurement
Substrates
Thermal expansion
Thermal stress
Thickness
Thin films
Tribology
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Summary:The reliability of a substrate curvature-based stress measurement method for CrN thin films on substrate with fluctuant surface was discussed. The stress error led by the ignorance of substrate thermal deformation was studied. Results showed that this error could be as large as several hundred MPa under general deposition conditions. Stress in the CrN thin films with different thicknesses ranging from 110 to 330 nm on stainless steel was studied by this method, in comparison with conventional results on silicon wafer. The thin films’ morphology and structure were investigated and related to the film stress. A significant result of the comparison is that stress evolution in the thin films on steel obviously differs from that on silicon wafer, not only because the two substrates have different coefficients of thermal expansion, which provokes thermal stress, but also the considerable discrepancy in the thin films’ grain coarsening rate and structure that induce different intrinsic stresses.
ISSN:1006-7191
2194-1289
DOI:10.1007/s40195-017-0620-5