Energy Density Dependence of Bonding Characteristics of Selective Laser-Melted Nb–Si-Based Alloy on Titanium Substrate

Spherical Nb–20Si–24Ti–2Cr–2Al pre-alloyed powders were processed by selective laser melting (SLM) on Ti6Al4V substrates with different energy densities. A series of single tracks and single layers were produced using different processing parameters, including powder size, laser power, scanning spee...

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Bibliographic Details
Published in:Acta metallurgica sinica : English letters 2018-05, Vol.31 (5), p.477-486
Main Authors: Guo, Yue-Ling, Jia, Li-Na, Kong, Bin, Huang, Yong-Lin, Zhang, Hu
Format: Article
Language:English
Subjects:
Additive manufacturing
Alloy powders
Bonding
Characterization and Evaluation of Materials
Chemistry and Materials Science
Contact angle
Corrosion and Coatings
Interfacial bonding
Laser beam melting
Lasers
Materials Science
Mechanical properties
Metallic Materials
Microstructure
Morphology
Nanotechnology
Organometallic Chemistry
Oxidation
Penetration depth
Powder metallurgy
Process parameters
Silicon base alloys
Spectroscopy/Spectrometry
Titanium alloys
Titanium base alloys
Tribology
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Summary:Spherical Nb–20Si–24Ti–2Cr–2Al pre-alloyed powders were processed by selective laser melting (SLM) on Ti6Al4V substrates with different energy densities. A series of single tracks and single layers were produced using different processing parameters, including powder size, laser power, scanning speed and hatch distance. Results showed that the pre-alloyed powders ranging from 45 to 75 μm were more applicable to SLM with less balling tendency, in comparison with those between 75 and 180 μm. The increase in linear energy density (LED) resulted in the decrease in contact angle and the increase in the width of single track as well as its penetration depth into the substrate. Smaller hatch distance leaded to a larger remelted part of the former track and a higher volumetric laser energy density. With a thickness of 75.6 μm, an interfacial intermediate layer, enriched in Ti and depleted in Nb, Si, Cr and Al, was formed between the SLM part and the Ti6Al4V substrate. The mechanisms of the elimination of balling phenomenon by employing a higher LED and the interfacial bonding characteristics between Nb–Si-based alloys via SLM and the Ti6Al4V substrate were discussed.
ISSN:1006-7191
2194-1289
DOI:10.1007/s40195-017-0670-8