Development and Implementation of a DCM Boost Converter With Multilayer Stacked Circuits Achieving High Voltage Gain

In this article, a high-voltage-gain boost converter (HVGBC) is designed, analyzed, and implemented. The designed HVGBC topology incorporates a single-switch boost converter with multilayer capacitor-inductor-diode-capacitor ( CLDC ) stacked circuits for conversion of low-voltage input into high-vol...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on industrial electronics (1982) 2024-07, Vol.71 (7), p.1-11
Main Author: Pai, Kai-Jun
Format: Article
Language:English
Subjects:
Anodes
Capacitors
Cathodes
Circuits
Discontinuous conduction mode (DCM)
high step-up ratio
High voltages
High-voltage techniques
Inductance
Inductors
Multilayers
Nonhomogeneous media
peak-current-mode control (PCMC)
Prototypes
Pulse duration
stacked circuit
Switches
Topology
Voltage control
Voltage gain
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this article, a high-voltage-gain boost converter (HVGBC) is designed, analyzed, and implemented. The designed HVGBC topology incorporates a single-switch boost converter with multilayer capacitor-inductor-diode-capacitor ( CLDC ) stacked circuits for conversion of low-voltage input into high-voltage output. To reduce the core dimensions and inductor value, HVGBC inductors are designed to operate in discontinuous conduction mode, and peak-current-mode control is used. This study is the first to consider the number of CLDC circuit layers, inductance, and duty cycle of an HVGBC; moreover, element parameter derivations and calculations are provided for determining the withstanding voltages and currents of these elements. Complete design procedures are described in detail for the construction of a low-power HVGBC prototype that is lower than 20 W; this prototype used a commercial pulsewidth modulator to achieve voltage and peak-current-mode control. In the HVGBC, three- and four-layer CLDC stacked circuits were employed to achieve a high step-up ratio.
ISSN:0278-0046
1557-9948
DOI:10.1109/TIE.2023.3292858