General imperfect interface model for spherical–circular inclusion composites

From the compound sphere assemblage model involving the intermediate anisotropic coatings and appropriate limiting procedure, a general imperfect interface model for thermal conduction problem is constructed. This kind of interface includes both the highly conducting and lowly conducting ones as the...

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Bibliographic Details
Published in:Acta mechanica 2024-04, Vol.235 (4), p.2211-2229
Main Authors: Pham, Duc-Chinh, Nguyen, Trung-Kien
Format: Article
Language:English
Subjects:
Civil engineering
Classical and Continuum Physics
Composite materials
Conduction
Conductivity
Control
Dynamical Systems
Engineering
Engineering Fluid Dynamics
Engineering Thermodynamics
Heat and Mass Transfer
Inclusions
Interfacial bonding
Inverse problems
Mathematical models
Original Paper
Solid Mechanics
Theoretical and Applied Mechanics
Vibration
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Summary:From the compound sphere assemblage model involving the intermediate anisotropic coatings and appropriate limiting procedure, a general imperfect interface model for thermal conduction problem is constructed. This kind of interface includes both the highly conducting and lowly conducting ones as the specific cases. The analytical expressions of macroscopic conductivity, and microscopic fields in and around the inhomogeneities, are provided, with some comparisons with the results of another model in the literature. An equivalent inclusion approach is implemented in conjunction with a three-point correlation approximation to predict the effective conductivity of some periodic or random arrangements of imperfectly-bonded inclusions. The analytical model is also useful in the inverse problem to find the imperfect interface parameters from the available macroscopic experimental data.
ISSN:0001-5970
1619-6937
DOI:10.1007/s00707-023-03820-y