High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints

• Published in: Rare metals 2024-06, Vol.43 (6), p.2819-2831
• Main Authors: Tian, Na-Na, Zhang, Cong-Lin, Lyu, Peng, Guan, Jin-Tong, Cai, Jie, Guan, Qing-Feng, Guo, Shun
• Format: Article
• Language: English
• Subjects: Biomaterials; Bonded joints; Bonding strength; Chemistry and Materials Science; Diffusion rate; Diffusion welding; Electron beams; Energy; High current; Materials Engineering; Materials Science; Mechanical properties; Metallic Materials; Microstructure; Nanoscale Science and Technology; Original Article; Physical Chemistry; Shear strength; Solid solutions; Solution strengthening
• ISSN: 1001-0521; 1867-7185
• DOI: 10.1007/s12598-024-02617-9

This study investigates the influence of high-current pulsed electron beam (HCPEB) modification on the microstructure and shear strength of Cu/CuW joints. Reliable solid-state diffusion bonding of modified-Cu (M-Cu) and modified-CuW (M-CuW) was achieved by HCPEB modification pretreatment at a temperature of 800–900 °C and a pressure of 5 MPa for 10–50 min. Experiments demonstrate that HCPEB modification facilitates the dissolution of W and Cu, resulting in the formation of a Cu 0.4 W 0.6 solid solution and thus enhancing the uniform distribution of microstructures. Additionally, HCPEB-induced defects play a beneficial role in promoting the diffusion process by providing fast diffusion paths for elements. The optimal joints with the maximum shear strength of 213.7 MPa were obtained through bonding M-Cu and M-CuW at 900 °C and 5 MPa for 30 min, which attributes to the combined effects of fine-grained strengthening and solid solution strengthening. Overall, the application of HCPEB modification showcases its effectiveness in promoting element diffusion and enhancing the mechanical performance of the joints. Graphical abstract