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Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives

Polyacrylate‐based electrically conductive adhesives (PA‐based ECAs) have attracted much attention due to their wide applications in precise instruments and consumer electronics. To obtain high‐performance and environmentally friendly PA‐based ECAs, their main properties and corresponding mechanisms...

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Bibliographic Details
Published in:Polymer composites 2024-05, Vol.45 (7), p.5781-5803
Main Authors: Zhang, Fan, Tang, Nanlin, Jiang, Qingsong, Qi, Kailiang, Zhu, Xiang, Luo, Zilin, Kong, Xiangyun, Zang, Dongmian, Liu, Hesheng, Fang, Baizeng
Format: Article
Language:English
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Summary:Polyacrylate‐based electrically conductive adhesives (PA‐based ECAs) have attracted much attention due to their wide applications in precise instruments and consumer electronics. To obtain high‐performance and environmentally friendly PA‐based ECAs, their main properties and corresponding mechanisms to performance, chemical constitutions and structure–function relationships should be well understood, and the applications of recent PA‐based ECAs should be comprehensively summarized. This review focuses on the progress of PA‐based ECAs in the past two decades and discusses the featured properties, preparation of PA, the selection of conductive fillers and the adhibition of the ECAs. The aim of the review is to find the challenges of high‐performance ECAs and offer some measures and foresee their future development. Highlights Preparation methods of polyacrylate (PA)‐based composites are presented. Properties of PA‐based electrically conductive adhesives (ECAs) are outlined. Selection of conductive fillers and the adhibition of ECAs are discussed. Representative applications of PA‐based ECAs are exhibited. Present main challenges and future solutions are highlighted. This review highlights the focal points in the properties, fabrications, and representative applications of polyacrylate‐based electrically conductive adhesives and proposes their challenges and perspectives.
ISSN:0272-8397
1548-0569
DOI:10.1002/pc.28188