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Upside–Down Annealing of Oxide Thin‐Film Transistors and its Analysis Using Hydrogen‐Diffusion Model

Hydrogen plays a crucial role in controlling the electrical characteristics of oxide thin‐film transistors (TFTs). The conductivity of the semiconductor can be modulated by controlling the amount of hydrogen in the active layer. In this study, a thermal annealing of the sample in an inverted orienta...

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Published in:Physica status solidi. A, Applications and materials science Applications and materials science, 2024-05, Vol.221 (9), p.n/a
Main Authors: Park, SeongJin, Kim, Kang, Park, Sang‐Hee Ko
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description Hydrogen plays a crucial role in controlling the electrical characteristics of oxide thin‐film transistors (TFTs). The conductivity of the semiconductor can be modulated by controlling the amount of hydrogen in the active layer. In this study, a thermal annealing of the sample in an inverted orientation (referred to as “upside‐down annealing”) is introduced. The impact of this approach on the hydrogen content within the In2O3 active layer is examined through the lens of a hydrogen diffusion model. By time‐of‐flight secondary ion mass spectrometry analysis, a hydrogen diffusion model for the TFT is established, and it is demonstrated that upside–down annealing is an effective method for preventing hydrogen depletion caused by out‐diffusion. A bottom‐gate bottom‐contact TFT is fabricated to analyze electrical characteristics. By employing different post‐thermal annealing methods on the device, it is discovered that the upside–down annealing enhances the device's performance significantly up to mobility of 22.3 cm2 V−1 s−1, which surpasses more than twice the mobility achieved with the traditionally oriented, “straight” annealed TFT. In this study, a thermal annealing method of oxide thin‐film transistors in an inverted orientation, called “upside‐down annealing,” is introduced. Upside–down annealing prevents hydrogen out‐diffusion from the In2O3 active layer and enhances mobility. The hydrogen content in the In2O3 active layer is examined through the lens of a hydrogen‐diffusion model.
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subjects Annealing
Diffusion layers
Electric contacts
Hydrogen
hydrogen diffusions
Indium oxides
interface trap sites
oxide thin film transistors
secondary ion mass spectrometries, vacuum annealings
Secondary ion mass spectrometry
Semiconductor devices
Thin film transistors
Transistors
title Upside–Down Annealing of Oxide Thin‐Film Transistors and its Analysis Using Hydrogen‐Diffusion Model
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