Stabilization of lead-free bulk CsSnI\(_3\) perovskite thermoelectrics via incorporating of TiS\(_3\) nanoribbon clusters

The intense research for efficient low-temperature thermoelectric materials motivates the exploration of innovative compounds and composite systems. This study examines the effects of integrating low-dimensional titanium trisulfide (TiS\(_3\)) into bulk tin-based halide perovskites (CsSnI\(_3\)) for...

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Bibliographic Details
Published in:arXiv.org 2024-05
Main Authors: Ivanova, Alexandra, Luchnikov, Lev, Golikova, Margarita, Muratov, Dmitry S, Saranin, Danila, Khanina, Aleksandra, Gostishchev, Pavel, Khovaylo, Vladimir
Format: Article
Language:English
Subjects:
Composite materials
Electrical properties
Electrical resistivity
Lead free
Low temperature
Nanoribbons
Oxidation
Perovskites
Seebeck effect
Structural stability
Temperature dependence
Thermoelectric materials
Titanium
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Summary:The intense research for efficient low-temperature thermoelectric materials motivates the exploration of innovative compounds and composite systems. This study examines the effects of integrating low-dimensional titanium trisulfide (TiS\(_3\)) into bulk tin-based halide perovskites (CsSnI\(_3\)) for use in thermoelectric applications. The addition of small amounts of two-dimensional titanium trisulfide (TiS\(_3\)) to bulk tin-based halide perovskites (CsSnI\(_3\)) significantly enhanced the structural stability of the composite material and suppressed oxidation processes. The CsSnI\(_3\)-TiS\(_3\) composites demonstrated stabilization of temperature-dependent electrical properties (conductivity and Seebeck coefficient). This study provides valuable insights into the promising approach of using low-dimensional TiS3 as an additive to stabilize the thermoelectric performance of CsSnI\(_3\).
ISSN:2331-8422