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Simple chemical solution deposition of Al2O3 dielectric layers for low-cost fabrication of transparent electronic devices
This study investigates the influence of chemically synthesized Al 2 O 3 dielectric layers on the performance of both metal–insulator - metal (MIM) capacitors (FTO/Al 2 O 3 /Au) and transparent thin film transistors (TTFTs) (FTO/Al 2 O 3 /ZnO/Au). Using two distinct formulations, a detail comparison...
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Published in: | Journal of materials science. Materials in electronics 2024-06, Vol.35 (16), p.1038, Article 1038 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites |
Online Access: | Get full text |
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Summary: | This study investigates the influence of chemically synthesized Al
2
O
3
dielectric layers on the performance of both metal–insulator
-
metal (MIM) capacitors (FTO/Al
2
O
3
/Au) and transparent thin film transistors (TTFTs) (FTO/Al
2
O
3
/ZnO/Au). Using two distinct formulations, a detail comparison based on varying precursors concentrations and the deposition time is presented. Scanning electron microscopy shows a nanopore morphology in the Al
2
O
3
dielectric layers. Electrical characterizations for MIM devices yielded leakage currents around
6
×
10
-
4
A
∙
cm
2
and capacitance values in the 107–77 nF/cm
2
range. For TTFTs, drain current vs drain-source voltage (
I
D
-V
DS
) (
∼
1
-
8.5
μ
A
) and drain current vs gate voltage (
I
D
-V
GS
) (on/off ratio 2.4 × 10
2
) were measured with chemically synthesized ZnO. Using a zinc oxide semiconductor as the active channel, the threshold voltage (
V
on/off
= ~ 36 V) and mobility (
µ
= 1.23 cm
2
/Vs) was obtained. The application of Al
2
O
3
as the dielectric gate, which acts as a substrate for ZnO deposition during device fabrication, induced a ZnO dendritic-like surface morphology, influencing channel conduction and exhibiting distinctive electrical behaviors corresponding to each formulation. Beyond the demonstrated capabilities of Al
2
O
3
in these devices, this material demonstrates advantages for highly transparent and effective low-cost device fabrication. |
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ISSN: | 0957-4522 1573-482X |
DOI: | 10.1007/s10854-024-12787-y |