Comprehensive investigation of oxidation behavior on ternary In–Zn–Sn lead-free solder electronic materials

The Oxidation behavior of ternary electronic lead-free solder In–Sn–Zn alloys are determined at 500, 600, and 700 °C by thermo gravimetric assembly system (TGA) which has been hooked up with a CAHN-1000 auto electric balance for alloys x Zn  = 0.9, x In / x Sn  = 1/1, x Zn  = 0.9, x In / x Sn  = ½ a...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2024-07, Vol.35 (21), p.1467, Article 1467
Main Author: Raushan Kumar, Mukesh
Format: Article
Language:English
Subjects:
Alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Copper
Electronic materials
Engineering
Indium
Investigations
Lead free
Materials Science
Optical and Electronic Materials
Oxidation
Oxidation rate
Solders
Tin
Zinc base alloys
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Summary:The Oxidation behavior of ternary electronic lead-free solder In–Sn–Zn alloys are determined at 500, 600, and 700 °C by thermo gravimetric assembly system (TGA) which has been hooked up with a CAHN-1000 auto electric balance for alloys x Zn  = 0.9, x In / x Sn  = 1/1, x Zn  = 0.9, x In / x Sn  = ½ and  x Zn  = 0.5,  x In / x Sn  = ½. The oxidation was carried out in the air for 50 min. The oxidation rate increases with temperature and decreases with time for the given alloy. The rate of oxidation also increases with the increase of zinc content in the alloy. It has also been observed that the alloy's oxidation rate decreases with the increase of In/Sn ratio, and the oxidation processes follow the parabolic rate law. The oxidation rate of alloy x Zn  = 0.9, x In/ x Sn  = ½ is higher at 700 °C as compared to the other two alloys.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-024-13237-5