P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor

Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the metho...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2024-06, Vol.55 (1), p.1914-1917
Main Authors: An, Qichang, Xiao, Yuelei, Li, Yue, Xu, Shuang, Zhao, Yingying, Hou, Xuecheng, Sun, Liang, Che, Chuncheng
Format: Article
Language:English
Subjects:
Dielectric loss
Failure mechanisms
Glass substrates
Inductor
Inductors
IPD
Optimization
Process optimization
TGV
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Summary:Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the method of process optimization.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.17962