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P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor
Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the metho...
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Published in: | SID International Symposium Digest of technical papers 2024-06, Vol.55 (1), p.1914-1917 |
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container_end_page | 1917 |
container_issue | 1 |
container_start_page | 1914 |
container_title | SID International Symposium Digest of technical papers |
container_volume | 55 |
creator | An, Qichang Xiao, Yuelei Li, Yue Xu, Shuang Zhao, Yingying Hou, Xuecheng Sun, Liang Che, Chuncheng |
description | Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the method of process optimization. |
doi_str_mv | 10.1002/sdtp.17962 |
format | article |
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language | eng |
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source | Wiley-Blackwell Read & Publish Collection |
subjects | Dielectric loss Failure mechanisms Glass substrates Inductor Inductors IPD Optimization Process optimization TGV |
title | P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor |
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