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P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor

Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the metho...

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Published in:SID International Symposium Digest of technical papers 2024-06, Vol.55 (1), p.1914-1917
Main Authors: An, Qichang, Xiao, Yuelei, Li, Yue, Xu, Shuang, Zhao, Yingying, Hou, Xuecheng, Sun, Liang, Che, Chuncheng
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container_title SID International Symposium Digest of technical papers
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creator An, Qichang
Xiao, Yuelei
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Xu, Shuang
Zhao, Yingying
Hou, Xuecheng
Sun, Liang
Che, Chuncheng
description Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the method of process optimization.
doi_str_mv 10.1002/sdtp.17962
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source Wiley-Blackwell Read & Publish Collection
subjects Dielectric loss
Failure mechanisms
Glass substrates
Inductor
Inductors
IPD
Optimization
Process optimization
TGV
title P‐136: Process Optimization for Fabrication of 3D Through Glass Via (TGV) Inductor
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