P‐152: The method of QD color conversion layer and pattern‐able Encapsulation with high thickness BM fabricated by inkjet‐printed process

This study develops a novel high‐thickness BM QD color conversion layer structure and a surface‐planarization process for QD materials after inkjet printing. This process reduces the height differences caused by the multi‐step exposure‐developing process. Following the fabrication of 8μm BM structur...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2024-06, Vol.55 (1), p.1968-1970
Main Authors: Hung, Chien-Chang, Yeh, Shu-Tang, Peng, Yi-Hao, Li, Ming-Chin, Ho, Jia-Chong, Chen, Kuang-Jung
Format: Article
Language:English
Subjects:
Color
color conversion layer
Component reliability
contact angle
Encapsulation
Energy conversion efficiency
Inkjet printing
Quantum dot
Reliability analysis
Solution heat treatment
Surface energy
surface treatment
Thickness
Thin Film Encapsulation
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Summary:This study develops a novel high‐thickness BM QD color conversion layer structure and a surface‐planarization process for QD materials after inkjet printing. This process reduces the height differences caused by the multi‐step exposure‐developing process. Following the fabrication of 8μm BM structure and 2μm CF structure, precise inkjet printing of QD materials is conducted within the 100ppi pixel area. we adjusted the surface energy of the color conversion layer by using an organic solution treatment to control the thickness profile and improve the color conversion efficiency. The printed QD materials are covered by a high‐transparency, low‐density polymer. After the color conversion layer component is encapsulated, reliability verification with a reliability assessment of 240 hours at RA (60℃ degrees, 90%RH) demonstrates an encapsulation effect where QD brightness retention rate remains above 90%.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.17979