The thermal performance of the thermosiphon under different parameters: Review study

• Main Authors: Alkhafaji, Osamah R. S., Majeed, Majid H., Al-Abbas, Audai H.
• Format: Conference Proceeding
• Language: English
• Subjects: Computational fluid dynamics; Cooling; Design parameters; Energy consumption; Evaporation rate; Fins; Geysers; Heat sinks; Heat transfer; Inclination angle; Literature reviews; Thermal resistance; Thermosyphons; Vertical orientation; Working fluids
• ISSN: 0094-243X; 1551-7616
• DOI: 10.1063/5.0212302

Nowadays, the increase of the consumed energy within cooling applications is still high. Therefore, enhancements and advancements of the thermal performance for those cooling applications with high heat transfer capabilities have a great importance. Thermosiphon and its integrated systems are one of best methods to assist thermal applications to transfer the heat energy with less power consumption. Thermosiphon mechanism involves evaporation of the working fluid by heat source and rejecting the transferring heat by condensation to the heat sink efficiently as compared to fins, or any auxiliary surfaces. Therefore, the seeking about more appropriate methods to enhance the heat transfer rate by thermosiphon are still required. The effects of thermosiphon inclination angles, the working fluid types, filling ratios, operation limitations and thermosiphon geometries are aimed to be focused throughout this reviewed study. The present study includes a wide range of literature survey that have been reported with emphasis on different investigated parameters for the thermosiphon applications. Obviously, it is tended to overcome most possible operation conditions, design limitations, and governing models in numerical and experimental works. The outcome results proposed that the best thermal performance for the thermosiphon have been executed under vertical position, middle range of the filling ratio and high active pressure. Also, the use of organic working fluid assists the thermal performance of thermosiphon. Furthermore, the lowest thermal resistance is reached under filling ratio range of 30%-60%; and the geyser boiling effect can be eliminated by increasing the applied heat with the filling ratio. Numerically, the use of (Volume of Fluid) VOF, UDF (User Defined Function) and Lee models provide more accurate results in the CFD (computational Fluid Dynamics) approach. According to this wide review, different investigations and recommendations were showed to present a clear knowledge about the thermosiphon and its applications, and to be as a basis for the future works.