Flexible capacitive pressure sensor sensitized by tilted micropillar structures fabricated by two-photon polymerization

An effective strategy to enhance the pressure sensitivity in flexible capacitive sensors is altering the microstructure of the dielectric layer surface. The common sensitized structures are cylindrical, hemispherical, and pyramidal. Limited by the common processes, such as replication and direct-wri...

Full description

Saved in:
Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2024-08, Vol.35 (23), p.1579, Article 1579
Main Authors: Xu, Ke, Tang, Yuhe, Liang, Jiawen, Zhao, Tianming, Guo, Hongji
Format: Article
Language:English
Subjects:
Asymmetric structures
Characterization and Evaluation of Materials
Chemistry and Materials Science
Deformation effects
External pressure
Materials Science
Molding (process)
Optical and Electronic Materials
Photons
Polymerization
Pressure effects
Pressure sensors
Recovery time
Sensors
Three dimensional printing
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:An effective strategy to enhance the pressure sensitivity in flexible capacitive sensors is altering the microstructure of the dielectric layer surface. The common sensitized structures are cylindrical, hemispherical, and pyramidal. Limited by the common processes, such as replication and direct-writing technology, it has rarely been investigated that the effect of asymmetric structures on the sensitization of flexible capacitive sensors. Hence, we propose a method based on two-photon polymerization to process tilted micropillar to enhance the pressure sensitivity. When subjected to external pressure, these tilted micropillar structures can undergo compressive and bending deformation, which endows the sensor with excellent response capability. The sensor exhibits a sensitivity of 0.1021 kPa −1 , a detection limit of 8 Pa, a fast response/recovery time of 60/50 ms, a stability of 6000 cycles, and a wide detection range (at least 160 kPa). The process combines the high precision of 3D printing with the flexibility of molding to process more complex sensitized structures. This technology can be used not only to prepare flexible capacitive pressure sensors but also to provide important support in the field of micro- and nano-manufacturing, such as electronic skin and microfluidic chips.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-024-13350-5